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BGA7210 Datasheet(PDF) 30 Page - NXP Semiconductors |
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BGA7210 Datasheet(HTML) 30 Page - NXP Semiconductors |
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30 / 30 page ![]() NXP Semiconductors BGA7210 700 MHz to 3800 MHz high linearity variable gain amplifier © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 4 January 2012 Document identifier: BGA7210 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 18. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 2.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 4 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Thermal characteristics . . . . . . . . . . . . . . . . . . 5 7 Static characteristics . . . . . . . . . . . . . . . . . . . . . 5 8 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 9 Serial Peripheral Interface . . . . . . . . . . . . . . . . 8 9.1 Command word format . . . . . . . . . . . . . . . . . . . 8 9.2 Setting current and attenuation . . . . . . . . . . . . 8 9.3 SPI timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 10 Power-up and power save. . . . . . . . . . . . . . . . 10 11 Application information. . . . . . . . . . . . . . . . . . 11 11.1 Application board . . . . . . . . . . . . . . . . . . . . . . 11 11.2 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 13 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 26 13 Packing information . . . . . . . . . . . . . . . . . . . . 27 14 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 27 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 27 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 28 16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 28 16.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 16.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 29 17 Contact information. . . . . . . . . . . . . . . . . . . . . 29 18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 |
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