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Electromigration Fail Mode

Wirebond Failure Mode

INA128-HT, INA129-HT

www.ti.com

SBOS501D – JANUARY 2010 – REVISED JUNE 2012

(1)

See the data sheet for absolute maximum and minimum recommended operating conditions.

(2)

The predicted operating lifetime vs. junction temperature is based on reliability modeling using electromigration as the

dominant failure mechanism affecting device wearout for the specific device process and design characterisitics.

(3)

Wirebond lifetime is only applicable for D package.

Figure 1. INA128HD/INA129SKGD1 Operating Life Derating Chart

Copyright © 2010–2012, Texas Instruments Incorporated

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Product Folder Link(s): INA128-HT INA129-HT