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SM320DM6446 Datasheet(PDF) 84 Page - Texas Instruments

Part # SM320DM6446
Description  Digital Media System-on-Chip
PDF  228 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

SM320DM6446 Datasheet(HTML) 84 Page - Texas Instruments

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5.2 Recommended Operating Conditions
SM320DM6446
Digital Media System-on-Chip
SPRS607A – JUNE 2009 – REVISED JUNE 2009
www.ti.com
MIN
NOM
MAX
UNIT
Supply voltage, Core (CVDD, VDDA1P1V, USB_VDDA1P2LDO
(1),
CVDD
1.14
1.2
1.26
V
CVDDDSP)
(2)
Supply voltage, I/O, 3.3V (DVDD33, USB_DVDDA3P3)
3.15
3.3
3.45
V
DVDD
Supply voltage, I/O, 1.8V (DVDD18, DVDDR2, DDR_VDDDLL,
1.71
1.8
1.89
V
PLLVDD18, VDDA1P8V, USB_VDD1P8, MXVDD, M24VDD)
Supply ground (VSS, VSSA1P8V, VSSA1P1V, DDR_VSSDLL,
VSS
USB_VSSREF, USB_VSS1P8, USB_VSSA3P3, USB_VSSA1P2LDO,
0
0
0
V
MXVSS
(3), M24V
SS
(3))
DDR_VREF
DDR2 reference voltage(4)
0.49DVDDR2
0.5DVDDR2
0.51DVDDR2
V
DDR_ZP
DDR2 impedance control, connected via 200
Ω resistor to V
SS
VSS
V
DDR2 impedance control, connected via 200
Ω resistor to
DDR_ZN
DVDDR2
V
DVDDR2
DAC_VREF
DAC reference voltage input
0.475
0.5
0.525
V
DAC_RBIAS
DAC biasing, connected via 4 k
Ω resistor to V
SSA_1P8V
VSSA_1P8V
V
USB_VBUS
USB external charge pump input
4.75
5
5.25
V
High-level input voltage, I/O, 3.3V
2
V
VIH
High-level input voltage, non-DDR I/O, 1.8V
0.65DVDD
V
Low-level input voltage, I/O, 3.3V
0.8
V
VIL
Low-level input voltage, non-DDR I/O, 1.8V
0.35DVDD
V
TC
Operating case temperature
-40
105
°C
FSYSCLK1
DSP Operating Frequency (SYSCLK1)
20
594
MHz
(1)
This pin is an internal LDO output and connected via 1
µF capacitor to USB_V
SSA1P2LDO.
(2)
Future variants of TI SOC devices may operate at voltages ranging from 0.9 V to 1.4 V to provide a range of system power/performance
options. TI highly recommends that users design-in a supply that can handle multiple voltages within this range (i.e., 1.0 V, 1.05 V,
1.1 V, 1.14 V, 1.2, 1.26 V with
±3% tolerances) by implementing simple board changes such as reference resistor values or input pin
configuration modifications. Not incorporating a flexible supply may limit the system's ability to easily adapt to future versions of TI SOC
devices.
(3)
Oscillator ground must be kept separate from other grounds and connected directly to the crystal load capacitor ground.
(4)
DDR_VREF is expected to equal 0.5DVDDR2 of the transmitting device and to track variations in the DVDDR2.
Device Operating Conditions
84
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