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SM320DM6446 Datasheet(PDF) 84 Page - Texas Instruments |
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SM320DM6446 Datasheet(HTML) 84 Page - Texas Instruments |
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84 / 228 page ![]() 5.2 Recommended Operating Conditions SM320DM6446 Digital Media System-on-Chip SPRS607A – JUNE 2009 – REVISED JUNE 2009 www.ti.com MIN NOM MAX UNIT Supply voltage, Core (CVDD, VDDA1P1V, USB_VDDA1P2LDO (1), CVDD 1.14 1.2 1.26 V CVDDDSP) (2) Supply voltage, I/O, 3.3V (DVDD33, USB_DVDDA3P3) 3.15 3.3 3.45 V DVDD Supply voltage, I/O, 1.8V (DVDD18, DVDDR2, DDR_VDDDLL, 1.71 1.8 1.89 V PLLVDD18, VDDA1P8V, USB_VDD1P8, MXVDD, M24VDD) Supply ground (VSS, VSSA1P8V, VSSA1P1V, DDR_VSSDLL, VSS USB_VSSREF, USB_VSS1P8, USB_VSSA3P3, USB_VSSA1P2LDO, 0 0 0 V MXVSS (3), M24V SS (3)) DDR_VREF DDR2 reference voltage(4) 0.49DVDDR2 0.5DVDDR2 0.51DVDDR2 V DDR_ZP DDR2 impedance control, connected via 200 Ω resistor to V SS VSS V DDR2 impedance control, connected via 200 Ω resistor to DDR_ZN DVDDR2 V DVDDR2 DAC_VREF DAC reference voltage input 0.475 0.5 0.525 V DAC_RBIAS DAC biasing, connected via 4 k Ω resistor to V SSA_1P8V VSSA_1P8V V USB_VBUS USB external charge pump input 4.75 5 5.25 V High-level input voltage, I/O, 3.3V 2 V VIH High-level input voltage, non-DDR I/O, 1.8V 0.65DVDD V Low-level input voltage, I/O, 3.3V 0.8 V VIL Low-level input voltage, non-DDR I/O, 1.8V 0.35DVDD V TC Operating case temperature -40 105 °C FSYSCLK1 DSP Operating Frequency (SYSCLK1) 20 594 MHz (1) This pin is an internal LDO output and connected via 1 µF capacitor to USB_V SSA1P2LDO. (2) Future variants of TI SOC devices may operate at voltages ranging from 0.9 V to 1.4 V to provide a range of system power/performance options. TI highly recommends that users design-in a supply that can handle multiple voltages within this range (i.e., 1.0 V, 1.05 V, 1.1 V, 1.14 V, 1.2, 1.26 V with ±3% tolerances) by implementing simple board changes such as reference resistor values or input pin configuration modifications. Not incorporating a flexible supply may limit the system's ability to easily adapt to future versions of TI SOC devices. (3) Oscillator ground must be kept separate from other grounds and connected directly to the crystal load capacitor ground. (4) DDR_VREF is expected to equal 0.5DVDDR2 of the transmitting device and to track variations in the DVDDR2. Device Operating Conditions 84 Submit Documentation Feedback |
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