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KMA220 Datasheet(PDF) 33 Page - NXP Semiconductors |
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KMA220 Datasheet(HTML) 33 Page - NXP Semiconductors |
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33 / 36 page  KMA220 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 1 — 24 May 2012 33 of 36 NXP Semiconductors KMA220 Dual channel programmable angle sensor 21. Handling information 22. Solderability information The solderability qualification is according to AEC-Q100 Rev-G. Recommended soldering process for leaded devices is wave soldering. The maximum soldering temperature is 260 C for maximum 5 s. Device terminals are compatible with laser and electrical welding. 23. Revision history Dimensions in mm (1) No bending allowed. (2) Plastic body and interface plastic body - leads: application of bending forces not allowed. Fig 21. Bending recommendation 0.7(1) R 0.25 min (1) (2) aaa-000907 Table 29. Revision history Document ID Release date Data sheet status Change notice Supersedes KMA220 v.1 20120524 Product data sheet - - |
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