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LPC4088 Datasheet(PDF) 115 Page - NXP Semiconductors |
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LPC4088 Datasheet(HTML) 115 Page - NXP Semiconductors |
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115 / 123 page ![]() LPC408X_7X All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Objective data sheet Rev. 1 — 17 September 2012 115 of 123 NXP Semiconductors LPC408x/7x 32-bit ARM Cortex-M4 microcontroller Fig 48. Reflow soldering of the TFBGA180 package DIMENSIONS in mm PSL SP SR Hx Hy Hx Hy SOT570-2 solder land plus solder paste occupied area Footprint information for reflow soldering of TFBGA180 package solder land solder paste deposit solder resist P P SL SP SR Generic footprint pattern Refer to the package outline drawing for actual layout detail X see detail X sot570-2_fr 0.80 0.400 0.400 0.550 12.575 12.575 |
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