AD7714YN datasheet(40/40 Pages) AD

40 / 40 page

AD7714

REV. C

–40–

OUTLINE DIMENSIONS

Dimensions are shown in inches and (mm).

24-Lead Plastic DIP

(N-24)

112

0.260 ± 0.001

(6.61 ± 0.03)

PIN 1

1.228 (31.19)

1.226 (31.14)

0.11 (2.79)

0.016 (2.28)

SEATING

PLANE

0.02 (0.5)

0.019 (0.41)

0.130 (3.30)

0.128 (7.62)

0.07 (1.78)

0.05 (1.27)

0.32 (8.128)

0.30 (7.62)

0.011 (0.28)

0.009 (0.23)

NOTES:

1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH

2. PLASTIC LEADS WILL BE EITHER SOLDER DIPPED OR TIN PLATED

IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.

24-Lead Wide Body SOIC

(R-24)

0.608 (15.45)

0.596 (15.13)

0.414 (10.52)

0.398 (10.10)

0.299 (7.6)

0.291 (7.39)

PIN 1

SEATING

PLANE

0.01 (0.254)

0.006 (0.15)

0.019 (0.49)

0.014 (0.35)

0.096 (204)

0.089 (2.26)

0.05 (1.27)

BSC

0.013 (0.32)

0.009 (0.23)

0.0500 (1.27)

0.0157 (0.40)

0.03 (0.76)

0.02 (0.51)

NOTES:

1. LEAD NO. 1 IDENTIFIED BY DOT.

2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED

IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.

28-Lead Shrink Small Outline Package SSOP

(RS-28)

0.009 (0.229)

0.005 (0.127)

0.03 (0.762)

0.022 (0.558)

0.008 (0.203)

0.002 (0.050)

0.07 (1.79)

0.066 (1.67)

SEATING

PLANE

0.0256 (0.65)

BSC

0.311 (7.9)

0.301 (7.64)

0.212 (5.38)

0.205 (5.207)

0.407 (10.34)

0.397 (10.08)

PIN 1

NOTES:

1. LEAD NO. 1 IDENTIFIED BY DOT.

2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED

IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.

24-Lead Thin Shrink Small Outline Package TSSOP

(RU-24)

0.311 (7.90)

0.303 (7.70)

PIN 1

SEATING

PLANE

0.006 (0.15)

0.002 (0.05)

0.0118 (0.30)

0.0075 (0.19)

0.0256 (0.65)

BSC

0.0433

(1.10)

MAX

0.0079 (0.20)

0.0035 (0.090)

0.028 (0.70)

0.020 (0.50)

AD7714YN Datasheet(PDF) 40 Page - Analog Devices

AD7714YN Datasheet(HTML) 40 Page - Analog Devices

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40

Datasheet Download

Link URL