THS7320

SBOS565B – JULY 2011 – REVISED SEPTEMBER 2012

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

TRANSPORT MEDIA,

PACKAGED DEVICES

PACKAGE TYPE

PACKAGE MARKING

QUANTITY

THS7320IYHCR

DSBGA (9-Ball WCSP)

QJK

Tape and Reel, 3000

Pb-Free, Green

THS7320IYHCT

DSBGA (9-Ball WCSP)

QJK

Tape and Reel, 250

Pb-Free, Green

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the

device product folder at www.ti.com.

(2)

Eco-Status information. Additional details including specific material content can be accessed at www.ti.com/leadfree.

GREEN: TI defines Green to mean Lead (Pb)-Free and in addition, uses less package materials that do not contain halogens, including

bromine (Br), or antimony (Sb) above 0.1% of total product weight. N/A: Not yet available Lead (Pb)-Free; for estimated conversion

dates, go to www.ti.com/leadfree.

Pb-FREE: TI defines Lead (Pb)-Free to mean RoHS compatible, including a lead concentration that does not exceed 0.1% of total

product weight, and, if designed to be soldered, suitable for use in specified lead-free soldering processes.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range, unless otherwise noted.

VALUE

UNIT

–0.4 to +5.5

V

Video input voltage, video enable pin

V

±75

mA

Continuous power dissipation

See Thermal Information table

+150

°C

+125

°C

+300

°C

Human body model (HBM)

6000

V

ESD ratings: all pins

Charge device model (CDM)

1000

V

Machine model (MM)

200

V

ESD ratings: video output pins

IEC 61000-4-2 contact discharge

20

kV

(1)

Stresses these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade

device reliability. These are stress ratings only and functional operation of the device at these or any other conditions beyond those

specified is not implied.

(2)

The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process.

(3)

The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this

temperature may result in reduced reliability and/or lifetime of the device.

RECOMMENDED OPERATING CONDITIONS

MIN

NOM

MAX

UNIT

2.6

3

5

V

–40

+85

°C

2

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