OR3LP26B datasheet(154/184 Pages) AGERE

154 / 184 page

ORCA OR3LP26B FPSC

Data Sheet

Embedded Master/Target PCI Interface

March 2000

154

Lucent Technologies Inc.

Pin Information (continued)

Package Compatibility

Table 69 lists the number of user I/Os available for the

ORCA OR3LP26B FPSC for each available package. Each

package has six dedicated configuration pins and six dedicated special-purpose pins.

Table 70 provides the package pin and pin function for the

ORCA OR3LP26B FPSC in each available package. The

bond pad name is identified in the PIC nomenclature used in the

ORCA Foundry design editor.

When the number of FPGA bond pads exceeds the number of package pins, bond pads are unused. When the

number of package pins exceeds the number of bond pads, package pins are left unconnected (no connects).

When a package pin is to be left as a no connect for a specific die, it is indicated as a note in the device pad column

for the FPGA.

Table 69.

ORCA OR3LP26B I/Os Summary

* User I/O count includes three ExpressCLK inputs.

† Configuration pins: CCLK, DONE, RESET, PRGM, RD_CFG;

Special-purpose pins: RD_DATA/TDO, HDC, LDC, INIT, M0, M1, M2.

352-Pin PBGA

680-Pin PBGAM

User I/Os*

162

242

VDD

VDD211

VSS

100

Configuration/Special-Purpose Pins†

PCI Interface Pins

Unused Pins

PCI Core Section

FPGA Section

OR3LP26B Datasheet(PDF) 154 Page - Agere Systems