AD9102-EBZ datasheet(8/36 Pages) AD

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AD9102

Data Sheet

Rev. 0 | Page 8 of 36

ABSOLUTE MAXIMUM RATINGS

Table 9.

Parameter

Rating

AVDD1, AVDD2, DVDD to AGND, DGND,

CLKGND

−0.3 V to +3.9 V

CLKVDD to AGND, DGND, CLKGND

−0.3 V to +3.9 V

CLDO, DLDO1, DLDO2 to AGND, DGND,

CLKGND

−0.3 V to 2.2 V

AGND to DGND, CLKGND

−0.3 V to +0.3 V

DGND to AGND, CLKGND

−0.3 V to +0.3 V

CLKGND to AGND, DGND

−0.3 V to +0.3 V

CS, SDIO, SCLK, SDO/

SDI2/DOUT, RESET, TRIGGER to

DGND

−0.3 V to DVDD + 0.3 V

CLKP, CLKN to CLKGND

−0.3 V to CLKVDD + 0.3 V

REFIO to AGND

−1.0 V to AVDD + 0.3 V

IOUTP, IOUTN to AGND

−0.3 V to DVDD + 0.3 V

FSADJ, CAL_SENSE to AGND

−0.3 V to AVDD + 0.3 V

Junction Temperature

125°C

Storage Temperature Range

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a standard circuit board for surface-mount

packages. θJC is measured from the solder side (bottom) of the

package.

Table 10. Thermal Resistance

Package Type

θJA

θJB

θJC

Unit

32-Lead LFCSP with Exposed

Paddle

30.18

6.59

3.84

°C/W

ESD CAUTION

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