PIC16LF1824 datasheet(357/440 Pages) MICROCHIP

357 / 440 page

 2011-2013 Microchip Technology Inc.

Preliminary

DS40001453D-page 357

PIC16(L)F1847

30.6

Thermal Considerations

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C

 TA  +125°C

Param.

No.

Sym.

Characteristic

Typ.

Units

Conditions

TH01

JA

Thermal Resistance Junction to Ambient

65.5

C/W

18-pin PDIP package

76.0

C/W

18-pin SOIC package

87.3

C/W

20-pin SSOP package

31.1

C/W

28-pin QFN (6x6mm) package

52.5

C/W

28-pin UQFN (4x4mm) package

TH02

JC

Thermal Resistance Junction to Case

29.5

C/W

18-pin PDIP package

23.5

C/W

18-pin SOIC package

31.1

C/W

20-pin SSOP package

5.0

C/W

28-pin QFN (6x6mm) package

9.5

C/W

28-pin UQFN (4x4mm) package

TH03

TJMAX

Maximum Junction Temperature

150

C

TH04

Power Dissipation

—

PD = PINTERNAL + PI/O

TH05

PINTERNAL Internal Power Dissipation

—

PINTERNAL = IDD x VDD (Note 1)

TH06

PI/O

I/O Power Dissipation

—

PI/O =

 (IOL * VOL) +  (IOH * (VDD - VOH))

TH07

PDER

Derated Power

—

PDER = PDMAX (TJ - TA)/

JA (Note 2)

Note 1:

IDD is current to run the chip alone without driving any load on the output pins.

TA = Ambient Temperature; TJ = Junction Temperature.

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