BF516F datasheet(64/68 Pages) AD

64 / 68 page

Rev. B

Page 64 of 68

January 2011

ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F

SURFACE-MOUNT DESIGN

Table 56 is provided as an aid to PCB design. For industry

standard design recommendations, refer to IPC-7351, Generic

Requirements for Surface Mount Design and Land Pattern

Standard.

Figure 73. 168-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

(BC-168-1)

Dimensions shown in millimeters

0.80

BSC

10.40

BSC SQ

12.10

12.00 SQ

11.90

COMPLIANT TO JEDEC STANDARDS MO-275-GGAB-1.

0.80

REF

0.70

REF

0.36

REF

642

BOTTOM VIEW

DETAIL A

TOP VIEW

DETAIL A

COPLANARITY

0.20

0.50

0.45

0.40

BALL DIAMETER

SEATING

PLANE

A1 BALL

CORNER

A1 BALL

CORNER

0.34 NOM

0.29 MIN

1.50

1.40

1.30

1.12

1.06

1.00

14 13

Table 56. BGA Data for Use with Surface-Mount Design

Package

Package Ball Attach Type

Package Solder Mask

Opening

Package Ball Pad Size

168-Ball CSP_BGA

Solder Mask Defined

0.35 mm diameter

0.48 mm diameter

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