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BF516F Datasheet(PDF) 17 Page - Analog Devices |
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BF516F Datasheet(HTML) 17 Page - Analog Devices |
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17 / 68 page ![]() ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F Rev. B | Page 17 of 68 | January 2011 SIGNAL DESCRIPTIONS The processors’ signal definitions are listed in Table 7. In order to maintain maximum function and reduce package size and signal count, some signals have dual, multiplexed functions. In cases where signal function is reconfigurable, the default state is shown in plain text, while the alternate function is shown in italics. All pins are three-stated during and immediately after reset, with the exception of the external memory interface, asynchro- nous and synchronous memory control, and the buffered XTAL output pin (CLKBUF). On the external memory interface, the control and address lines are driven high, with the exception of CLKOUT, which toggles at the system clock rate. During hiber- nate all outputs are three-stated unless otherwise noted in Table 7. All I/O signals have their input buffers disabled with the excep- tion of the signals noted in the data sheet that need pull-ups or pull downs if unused. The SDA (serial data) and SCL (serial clock) pins/balls are open drain and therefore require a pullup resistor. Consult version 2.1 of the I2C specification for the proper resistor value. It is strongly advised to use the available IBIS models to ensure that a given board design meets overshoot/undershoot and sig- nal integrity requirements. If no IBIS simulation is performed, it is strongly recommended to add series resistor terminations for all Driver Types A, C and D. The termination resistors should be placed near the processor to reduce transients and improve signal integrity. The resistance value, typically 33 Ω or 47 Ω, should be chosen to match the average board trace impedance. Additionally, adding a parallel termination to CLKOUT may prove useful in further enhancing signal integrity. Be sure to verify overshoot/undershoot and signal integrity specifications on actual hardware. Table 7. Signal Descriptions Signal Name Type Function Driver Type1 EBIU ADDR19–1 O Address Bus A DATA15–0 I/O Data Bus A ABE1–0/SDQM1–0 O Byte Enable or Data Mask A AMS1–0 O Asynchronous Memory Bank Selects (Require pull-ups if hibernate is used) A ARE O Asynchronous Memory Read Enable A AWE O Asynchronous Memory Write Enable A SRAS O SDRAM Row Address Strobe A SCAS O SDRAM Column Address Strobe A SWE OSDRAM Write Enable A SCKE O SDRAM Clock Enable (Requires a pull-down if hibernate with SDRAM self-refresh is used) A CLKOUT O SDRAM Clock Output B SA10 O SDRAM A10 Signal A SMS O SDRAM Bank Select A Port F: GPIO and Multiplexed Peripherals PF0/ETxD2/PPI D0/SPI1SEL2/TACLK6 I/O GPIO/Ethernet MII Transmit D2/PPI Data 0/SPI1 Slave Select 2/Timer6 Alternate Clock C PF1/ERxD2/PPI D1/PWM AH/TACLK7 I/O GPIO/Ethernet MII Receive D2/PPI Data 1/PWM AH Output/Timer7 Alternate Clock C PF2/ETxD3/PPI D2/PWM AL I/O GPIO/Ethernet Transmit D3/PPI Data 2/PWM AL Output C PF3/ERxD3/PPI D3/PWM BH/TACLK0 I/O GPIO/Ethernet MII Data Receive D3/PPI Data 3/PWM BH Output/Timer0 Alternate Clock C PF4/ERxCLK/PPI D4/PWM BL/TACLK1 I/O GPIO/Ethernet MII Receive Clock/PPI Data 4/PWM BL Out/Timer1 Alternate CLK C PF5/ERxDV/PPI D5/PWM CH/TACI0 I/O GPIO/Ethernet MII Receive Data Valid/PPI Data 5/PWM CH Out /Timer0 Alternate Capture Input C PF6/COL/PPI D6/PWM CL/TACI1 I/O GPIO/Ethernet MII Collision/PPI Data 6/PWM CL Out/Timer1 Alternate Capture Input C PF7/SPI0SEL1/PPI D7/PWMSYNC I/O GPIO/SPI0 Slave Select 1/PPI Data 7/PWM Sync C |
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