LM73 datasheet(4/26 Pages) TI1

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LM73

SNIS141D – OCTOBER 2005 – REVISED MAY 2009

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS

(1)

Supply Voltage

−0.3 V to 6.0 V

Voltage at SMBCLK and SMBDAT pins

−0.3 V to 6.0 V

Voltage at All Other Pins

−0.3 V to (VDD + 0.5 V) and ≤ 6.0 V

Input Current at Any Pin(2)

±5 mA

Storage Temperature

−65°C to +150°C

ESD Susceptibility(3)

Human Body Model

2000 V

Machine Model

200 V

Soldering process must comply with Texas Instruments' Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.(4)

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not

apply when operating the device beyond its rated operating conditions.

(2)

When the input voltage (VI) at any pin exceeds the power supplies (VI < GND or VI > VDD), the current at that pin should be limited to 5

mA.

(3)

Human body model, 100 pF discharged through a 1.5 k

Ω resistor. Machine model, 200 pF discharged directly into each pin.

(4)

Reflow temperature profiles are different for lead-free and non-lead-free packages.

OPERATING RATINGS

(1)

Specified Temperature Range TMIN ≤ TA ≤ TMAX

−40°C ≤ TA ≤ +150°C

Supply Voltage Range (VDD)

+2.7V to +5.5V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not

apply when operating the device beyond its rated operating conditions.

TEMPERATURE-TO-DIGITAL CONVERTER CHARACTERISTICS

Unless otherwise noted, these specifications apply for VDD = 2.7V to 5.5V. Boldface limits apply for TA = TJ =TMIN to TMAX;

all other limits TA = TJ = +25°C, unless otherwise noted. TA is the ambient temperature. TJ is the junction temperature.

LM73C

Units

Parameter

Conditions

Typical(1)

Limits(2)

(Limit)

Accuracy(3)

TA = −10°C to 80°C

±1.0

°C (max)

VDD = 2.7V

TA = −25°C to 115°C

±1.5

°C (max)

VDD = 4.5V

TA = −40°C to 150°C

±2.0

°C (max)

TA = −10°C to 80°C

±1.5

°C (max)

VDD > 4.5V

TA = −25°C to 115°C

±2.0

°C (max)

VDD = 5.5V

TA = −40°C to 150°C

±2.5

°C (max)

Resolution

RES1 Bit = 0, RES0 Bit = 0

Bits

0.25

°C/LSB

RES1 Bit = 0, RES0 Bit = 1

Bits

0.125

°C/LSB

RES1 Bit = 1, RES0 Bit = 0

Bits

0.0625

°C/LSB

RES1 Bit = 1, RES0 Bit = 1

Bits

0.03125

°C/LSB

(1)

Typicals are at TA = 25°C and represent most likely parametric norm.

(2)

Limits are ensured to TI's AOQL (Average Outgoing Quality Level).

(3)

Local temperature accuracy does not include the effects of self-heating. The rise in temperature due to self-heating is the product of the

internal power dissipation of the LM73 and the thermal resistance.

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