C2012 datasheet(70/72 Pages) TDK

70 / 72 page

TDK MLCC US Catalog

Version B11

Page 72

Soldering

Information

C Series – General Application

Wave Soldering

Unit: mm

Type

Symbol

C1608

[CC0603]

C2012

[CC0805]

C3216

[CC1206]

0.7 - 1.0

1.0 - 1.3

2.1 - 2.5

0.8 - 1.0

1.0 - 1.2

1.1 - 1.3

0.6 - 0.8

0.8 - 1.1

1.0 - 1.3

• Recommended Soldering Land Pattern

• Recommended Soldering Profile

Chip capacitor

Solder land

Solder resist

Reflow Soldering

Unit: mm

Type

Symbol

C0603

[CC0201]

C1005

[CC0402]

C1608

[CC0603]

C2012

[CC0805]

0.25 - 0.35

0.3 - 0.5

0.6 - 0.8

0.9 - 1.2

0.2 - 0.3

0.35 - 0.45

0.6 - 0.8

0.7 - 0.9

0.25 - 0.35

0.4 - 0.6

0.6 - 0.8

0.9 - 1.2

Reflow Soldering

Unit: mm

Type

Symbol

C3216

[CC1206]

C3225

[CC1210]

C4532

[CC1812]

C5750

[CC2220]

2.0 - 2.4

3.1 - 3.7

4.1 - 4.8

1.0 - 1.2

1.2 - 1.4

1.1 - 1.6

1.9 - 2.5

2.4 - 3.2

4.0 - 5.0

Excessive

solder

Higher tensile

force on the chip

capacitor may

cause cracking.

Adequate

solder

Insufficient

solder

Small solder fillet

may cause

contact failure or

failure to hold the

chip capacitor to

the P.C. board.

• Recommended Solder Amount

Maximum amount

Minimum amount

Recommended soldering duration

Temp./

Dura.

Solder

Wave Soldering

Reflow Soldering

Peak temp

(°C)

Duration

(sec.)

Peak temp

(°C)

Duration

(sec.)

Sn-Pb

Solder

250 max.

3 max.

230 max.

20 max.

Lead-Free

Solder

260 max.

5 max.

260 max.

10 max.

Recommended solder compositions

Sn-37Pb (Sn-Pb solder)

Sn-3.0Ag-0.5Cu (Lead Free Solder)

Preheating Condition

Soldering

Case Size - JIS (EIA)

Temp. (ºC)

Wave

soldering

C1608(CC0603), C2012(CC0805),

C3216(CC1206)

∆T ≤ 150

Reflow

soldering

C0603(CC0201), C1005(CC0402),

C1608(CC0603), C2012(CC0805),

C3216(CC1206)

∆T ≤ 150

C3225(CC1210), C4532(CC1812),

C5750(CC2220)

∆T ≤ 130

Manual

soldering

C0603(CC0201), C1005(CC0402),

C1608(CC0603), C2012(CC0805),

C3216(CC1206)

∆T ≤ 150

C3225(CC1210), C4532(CC1812),

C5750(CC2220)

∆T ≤ 130

Reflow Soldering

Manual soldering

(Solder iron)

∆T

Preheating

3sec. (As short as possible)

300

∆T

Soldering Natural

cooling

Preheating

Peak

Temp

Over 60 sec.

Peak Temp time

Wave Soldering

Peak

Temp

△

Preheating

Soldering

Natural

cooling

Over 60 sec.

Peak Temp time

C2012 Datasheet(PDF) 70 Page - TDK Electronics

C2012 Datasheet(HTML) 70 Page - TDK Electronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72

Datasheet Download

Link URL