TSL2671

DIGITAL PROXIMITY DETECTOR

TAOS118 − JANUARY 2011

24

r

r

Copyright

E 2011, TAOS Inc.

The LUMENOLOGY

r Company

www.taosinc.com

MANUFACTURING INFORMATION

The FN package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate.

The process, equipment, and materials used in these test are detailed below.

The solder reflow profile describes the expected maximum heat exposure of components during the solder

reflow process of product on a PCB. Temperature is measured on top of component. The components should

be limited to a maximum of three passes through this solder reflow profile.

Table 14. Solder Reflow Profile

PARAMETER

REFERENCE

DEVICE

Average temperature gradient in preheating

2.5

°C/sec

Soak time

2 to 3 minutes

Time above 217

°C (T1)

Max 60 sec

Time above 230

°C (T2)

Max 50 sec

Max 10 sec

Peak temperature in reflow

260

°C

Temperature gradient in cooling

Max −5

°C/sec

Not to scale — for reference only

Time (sec)

Figure 19. Solder Reflow Profile Graph