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AD7934 Datasheet(PDF) 29 Page - Analog Devices |
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AD7934 Datasheet(HTML) 29 Page - Analog Devices |
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29 / 32 page ![]() AD7933/AD7934 Rev. B | Page 29 of 32 APPLICATION HINTS GROUNDING AND LAYOUT Design the printed circuit board that houses the AD7933/AD7934 so that the analog and digital sections are separated and con- fined to certain areas of the board. This facilitates the use of ground planes that can be easily separated. Generally, a minimum etch technique is best for ground planes because it offers optimum shielding. Join digital and analog ground planes in only one place, establishing a star ground point connection as close as possible to the ground pins on the AD7933/AD7934. Avoid running digital lines under the device because this couples noise onto the die. However, the analog ground plane should be allowed to run under the AD7933/AD7934 to avoid noise coupling. To provide low impedance paths and reduce the effects of glitches on the power supply line, use as large a trace as possible on the power supply lines to the AD7933/AD7934. Shield fast switching signals, such as clocks, with digital ground to avoid radiating noise to other sections of the board, and never run clock signals near the analog inputs. Avoid crossover of digital and analog signals. To reduce the effects of feedthrough through the board, run traces on opposite sides of the board at right angles to each other. A microstrip technique is by far the best, but it is not always possible with a double-sided board. In this technique, the component side of the board is dedicated to ground planes, while signals are placed on the solder side. Good decoupling is also important. Decouple all analog supplies with 10 μF tantalum capacitors in parallel with 0.1 μF capacitors to GND. To achieve the best performance from these decoupling components, they must be placed as close as possible to the device, ideally right up against the device. The 0.1 μF capacitors should have a low effective series resistance (ESR) and effective series inductance (ESI), such as the common ceramic types or surface-mount types. These types of capacitors provide a low impedance path to ground at high frequencies to handle transient currents due to internal logic switching. EVALUATING THE AD7933/AD7934 PERFORMANCE The recommended layout for the AD7933/AD7934 is outlined in the evaluation board documentation. The evaluation board package includes a fully assembled and tested evaluation board, documentation, and software for controlling the board from the PC via the evaluation board controller. The evaluation board controller can be used in conjunction with the AD7933/AD7934 evaluation board, as well as many other Analog Devices evalua- tion boards ending in the CB designator, to demonstrate and evaluate the ac and dc performance of the AD7933/AD7934. The software allows the user to perform ac (fast Fourier transform) and dc (histogram of codes) tests on the AD7933/AD7934. The software and documentation are on the CD that ships with the evaluation board. |
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