Data Sheet

SSM2166

Rev. E | Page 17 of 20

OUTLINE DIMENSIONS

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-012-AB

14

8

7

1

6.20 (0.2441)

5.80 (0.2283)

4.00 (0.1575)

3.80 (0.1496)

8.75 (0.3445)

8.55 (0.3366)

1.27 (0.0500)

BSC

SEATING

PLANE

0.25 (0.0098)

0.10 (0.0039)

0.51 (0.0201)

0.31 (0.0122)

1.75 (0.0689)

1.35 (0.0531)

0.50 (0.0197)

0.25 (0.0098)

1.27 (0.0500)

0.40 (0.0157)

0.25 (0.0098)

0.17 (0.0067)

COPLANARITY

0.10

8°

0°

45°

Figure 32. 14-Lead Standard Small Outline Package [SOIC_N]

Narrow Body

(R-14)

Dimensions shown in millimeters and (inches)

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

SSM2166SZ

−40°C to +85°C

14-Lead SOIC_N

R-14

SSM2166SZ-REEL

−40°C to +85°C

14-Lead SOIC_N

R-14

SSM2166SZ-REEL7

−40°C to +85°C

14-Lead SOIC_N

R-14

1

Z = RoHS Compliant Part.

Top Branding Revision Reflecting Die Replacement

Version

Original Die Revision

(Prior to Rev. C of Data Sheet)

New Die Revision

(Rev. C to Current Revision of Data Sheet)

Pb-Free (RoHS) Version

Top Line 1: SSM

Top Line 1: SSM

Top Line 2: 2166

Top Line 2: 2166A1

Top Line 3: # XXXX2

Top Line 3: # XXXX2

1

Letter A designates new die revision; refer to revised external component values in Figure 5, Figure 6, Figure 9, and Figure 19.

2

# designates RoHS version.