AN4159 datasheet(8/27 Pages) STMICROELECTRONICS

Part #	AN4159

Description	Hardware and software guidelines for use of the LPS331AP

PDF	27 Pages

Scroll/Zoom	100%

Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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8 / 27 page

Pin mapping

AN4159

8/27

Doc ID 023639 Rev 3

Figure 5.

LPS331AP electrical connection

Key notes:

●

SDA and SCL pull-up resistors should be connected to VDD_IO

●

VDD_IO should be same or lower than VDD (use level shifters otherwise)

●

If VDD_IO is higher than VDD, high non-destructive current may occur

●

If there is choice and interface is I2C, use SA0 = VDDIO slave address by default.

3.0.1

Pressure sensor PCB layout and solder recommendations

The LPS331AP has an opening on top of the package, sensor performance can be

compromised by:

●

Mechanical stress coming from PCB board

–

The whole package surface + air should have minimum temperature gradient

–

Avoid placement in long and narrow PCB area, warp free area

●

Temperature gradients (non-uniform/rapidly changing temperature around sensor)

●

Strong electrical field / light source

●

Localized air pressure stability (unwanted fast air pressure variation, fans)

●

Dust and water exposure/condensation (GORE-TEX® protection, etc.)

AN4159 Datasheet(PDF) 8 Page - STMicroelectronics