AN2586 datasheet(27/28 Pages) STMICROELECTRONICS

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AN2586

Revision history

Doc ID 13675 Rev 7

27/28

Revision history

Table 7.

Document revision history

Date

Revision

Changes

12-Jul-2007

Initial release.

23-May-2008

Application note also applicable to High-density devices.

Figure 1: Power supply overview, Figure 2: Power supply scheme

and Figure 6: Clock overview updated.

Low-speed internal RC frequency modified in Section 2: Clocks on

page 11. VREF+ voltage range modified.

Table 6: Reference connection for all packages on page 25 added.

Small text changes.

23-Jun-2009

Connectivity line STM32F10xxx and Section : Glossary added.

Section 1.2: Power supply schemes and Figure 2: Power supply

scheme updated.

Figure 5: Reset circuit updated. Figure 6 Clock overview removed in

Section 2: Clocks. Note 1 added Note 3 updated below Figure 8:

External clock. Section 2.1.1: External source (HSE bypass) and

Section 2.1.2: External crystal/ceramic resonator (HSE crystal)

updated.

Section 2.3 Clock-out capability section removed.

Section 3.1: Boot mode selection and Section 3.3: Embedded boot

loader mode updated.

When no external battery is used, it is recommended to externally

connect the VBAT pin to VDD.

PA14 updated in Table 7: Document revision history.

Small text changes.

STM3210C-EVAL evaluation board added in Section 4.

01-Mar-2010

This application note also applies to STM32F100xx low- and

medium-density value line products:

– low- and medium-density value line devices added to Introduction

on page 1

– Section 2.1.1: External source (HSE bypass) and Section 2.1.2:

External crystal/ceramic resonator (HSE crystal) updated

– reference to value line’s evaluation board added to Section 4.1:

Introduction

Table 5: Reset circuit updated.

19-Oct-2010

Modified Section 2.2.1: External source (LSE bypass)

Updated for high-density value line devices.

14-Apr-2011

Updated VDDA and VREF schematics in Figure 14:

STM32F103ZE(T6) microcontroller reference schematic on page 24

and Table 5: Optional components.

18-Nov-2011

Updated to include XL-density devices.

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