UPD77112GC datasheet(75/80 Pages) NEC

75 / 80 page

Data Sheet U12801EJ4V0DS00

µµµµPD77110, 77111, 77112

12. RECOMMENDED SOLDERING CONDITIONS

It is recommended to solder this product under the following conditions.

For details of the recommended soldering conditions, refer to information document “SEMICONDUCTOR DEVICE

MOUNTING TECHNOLOGY MANUAL” (C10535E).

For soldering methods and conditions other than those recommended, consult NEC.

Surface mount type

µµµµPD77110GC-9EU: 100-pin plastic TQFP (fine pitch) (14 ×××× 14 mm)

µµµµPD77111GK-xxx-9EU: 80-pin plastic TQFP (fine pitch) (12 ×××× 12 mm)

Process

Conditions

Symbol

Infrared ray reflow

Package peak temperature: 235

°C, Time: 30 seconds MAX (210°C MIN),

Number of times: 2 MAX, Number of days: 3

Note (after that, prebaking is

necessary for 10 hours)

IR35-103-2

VPS

Package peak temperature: 215

°C, Time: 30 seconds MAX (210°C MIN),

Number of times: 2 MAX, Number of days: 3

Note (after that, prebaking is

necessary for 10 hours)

VP15-103-2

Partial heating method

Pin temperature: 300

°C MAX, Time: 3 seconds MAX (per side of device)

−

µµµµPD77112GC-xxx-9EU: 100-pin plastic TQFP (fine pitch) (14 ×××× 14 mm)

Process

Conditions

Symbol

Infrared ray reflow

Package peak temperature: 235

°C, Time: 30 seconds MAX (210°C MIN),

Number of times: 3 MAX, Number of days: 7

Note (after that, prebaking is

necessary for 10 hours)

IR35-107-3

VPS

Package peak temperature: 215

°C, Time: 30 seconds MAX (210°C MIN),

Number of times: 3 MAX, Number of days: 7

Note (after that, prebaking is

necessary for 10 hours)

VP15-107-3

Partial heating method

Pin temperature: 300

°C MAX, Time: 3 seconds MAX (per side of device)

−

Note Number of days in storage after the dry pack has been opened. The storage conditions are at 25

°C, 65%

RH MAX.

Caution Do not use two or more soldering methods in combination (except partial heating method).

UPD77112GC Datasheet(PDF) 75 Page - NEC

UPD77112GC Datasheet(HTML) 75 Page - NEC

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