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MAX1809EEE Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX1809EEE Datasheet(HTML) 2 Page - Maxim Integrated Products |
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2 / 17 page ![]() 3A, 1MHz, DDR Memory Termination Supply 2 _______________________________________________________________________________________ ABSOLUTE MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS (VIN = VCC = 3.3V, VEXTREF = 1.1V, TA = 0°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note 1: LX has clamp diodes to PGND and IN. If continuous current is applied through these diodes, thermal limits must be observed. VCC, IN to GND ........................................................-0.3V to +6V IN to VCC.............................................................................±0.3V GND to PGND.....................................................................±0.3V SHDN, SS, FB, TOFF, RREF, EXTREF to GND.......................................-0.3V to (VCC + 0.3V) LX Current (Note 1).............................................................±4.7A REF Short Circuit to GND Duration ............................Continuous Continuous Power Dissipation (TA = +70°C) 28-Pin QFN (derate 20mW/°C above +70°C; part mounted on 1in2 of 1oz copper) ..............................1.6W 16-Pin QSOP (derate 12.5mW/°C above +70°C; part mounted on 1in2 of 1oz copper) .................................1W Operating Temperature Range ...........................-40°C to +85°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Input Voltage VIN,VCC 3.0 5.5 V Feedback Voltage Accuracy (VFB - VEXTREF) VIN = VCC = 3V to 5.5V, ILOAD = 0, VEXTREF = 1.25V (Note 2) -12 +12 mV Feedback Load Regulation Error ∆VFB ILOAD = -3A to +3A, VEXTREF = 1.25V 20 mV External Reference Voltage Range VEXTREF VIN = VCC = 3V to 5.5V VREF - 0.01 VIN - 1.7 V Reference Voltage VREF 1.078 1.100 1.122 V Reference Load Regulation IREF = -1µA to +10µA 0.5 2.0 mV VIN = 4.5V 90 200 PMOS Switch On-Resistance RPMOS ILX = 0.5A VIN = 3V 110 250 m Ω VIN = 4.5V 70 150 NMOS Switch On-Resistance RNMOS ILX = 0.5A VIN = 3V 80 200 m Ω Current-Limit Threshold ILIMIT VIN > VLX 3.5 4.1 4.7 A Switching Frequency fSW (Note 3) 1 MHz ICC fSW = 500kHz 1 No Load Supply Current IIN fSW = 500kHz 16 mA Shutdown Supply Current ISHDN SHDN = GND, ICC + IIN <1 15 µA Thermal-Shutdown Threshold Hysteresis = 15 °C 160 °C Undervoltage Lockout Threshold VCC falling, hysteresis = 90mV 2.5 2.6 2.7 V FB Input Bias Current IFB VFB = VEXTREF + 0.1V 0 60 250 nA RTOFF = 30.1k Ω 0.24 0.30 0.37 RTOFF = 110k Ω 0.9 1.0 1.1 Off-Time tOFF RTOFF = 499k Ω 3.8 4.5 5.2 µs Startup Off-Time 4 x tOFF µs On-Time tON (Note 3) 0.35 µs |
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