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FT900 Datasheet(PDF) 40 Page - Future Technology Devices International Ltd.

Part # FT900
Description  The FT900 series includes the FT900,FT901, FT902 and FT903 which are complete System-On-Chip 32-bit RISC microcontrollers for embedded applications featuring a high level of integration and low powerconsumption
PDF  58 Pages
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Manufacturer  FTDI [Future Technology Devices International Ltd.]
Direct Link  http://www.ftdichip.com
Logo FTDI - Future Technology Devices International Ltd.

FT900 Datasheet(HTML) 40 Page - Future Technology Devices International Ltd.

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Copyright © 2014 Future Technology Devices International Limited
40
FT900/1/2/3 Embedded Microcontroller Datasheet
Version 1.0
Document No.: FT_000965 Clearance No.: FTDI#421
Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
(Including TX current)
100Base-TX mode
(Excluding TX current)
-
-
165
mW
100Base-TX mode
Auto-negotiation
mode
(Including TX current)
-
-
550
mW
100Base-TX mode
Auto-negotiation
mode
(Excluding TX current)
-
-
187
mW
100Base-TX mode
Power down mode
-
-
10
mW
Ethernet power
down
Table 5-5 Ethernet I/O pin (TXON/TXOP, RXIN/RXIP) characteristics
Note*: The VOUT2 is internal Regulator +1.2V voltage output which provide power supply for internal
Ethernet transceiver.
DC characteristics of DAC I/O cells
Parameter
Description
Minimum
Typical
Maximum
Units
Conditions
VCC3V3A
DAC power
supply
voltage
2.97
3.3
3.63
V
Normal Operation
VREFP
Reference
voltage
0
-
VCC3V3A
V
DCAP_REFP positive reference
RES
Resolution
10
-
-
Bits
-
INL
Integral
nonlinearity
error
-2
-
2
LSB
VREFP = VCC3V3A
DNL
Differential
nonlinearity
error
-1
-
1.5
LSB
VREFP = VCC3V3A
-
Conversion
latency
-
-
1
Clock
cycle
-
CLOAD
Output load:
rated
capacitance
-
-
10
pF
-
RLOAD
Output load:
rated
resistance
6.7
-
-
KΩ
-
Table 5-6 DAC I/O pin (DAC_REFP, DAC0/1) characteristics
DC characteristics of ADC I/O cells



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