ISO7340C_15 datasheet(6/34 Pages) TI

6 / 34 page

ISO7340C, ISO7340FC, ISO7341C, ISO7341FC, ISO7342C, ISO7342FC

SLLSEI6E – SEPTEMBER 2014 – REVISED APRIL 2015

www.ti.com

6.4 Thermal Information

THERMAL METRIC

DW (16 Pins)

UNIT

RθJA

Junction-to-ambient thermal resistance

78.4

RθJC(top)

Junction-to-case(top) thermal resistance

41.0

RθJB

Junction-to-board thermal resistance

43.0

°C/W

ψJT

Junction-to-top characterization parameter

15.6

ψJB

Junction-to-board characterization parameter

42.5

RθJC(bottom)

Junction-to-case(bottom) thermal resistance

n/a

Maximum Power Dissipation by ISO7340

VCC1 = VCC2 = 5.5V, TJ = 150°C,

PD1

Maximum Power Dissipation by Side-1 of ISO7340

CL = 15pF, Input a 12.5 MHz 50%

duty cycle square wave

PD2

Maximum Power Dissipation by Side-2 of ISO7340

Maximum Power Dissipation by ISO7341

102

VCC1 = VCC2 = 5.5V, TJ = 150°C,

PD1

Maximum Power Dissipation by Side-1 of ISO7341

CL = 15pF, Input a 12.5 MHz 50%

duty cycle square wave

PD2

Maximum Power Dissipation by Side-2 of ISO7341

Maximum Power Dissipation by ISO7342

111

VCC1 = VCC2 = 5.5V, TJ = 150°C,

PD1

Maximum Power Dissipation by Side-1 of ISO7342

CL = 15pF, Input a 12.5 MHz 50%

55.5

duty cycle square wave

PD2

Maximum Power Dissipation by Side-2 of ISO7342

55.5

Submit Documentation Feedback

Product Folder Links: ISO7340C ISO7340FC ISO7341C ISO7341FC ISO7342C ISO7342FC

ISO7340C Datasheet(PDF) 6 Page - Texas Instruments

ISO7340C Datasheet(HTML) 6 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34

Datasheet Download

Link URL