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ISO7340C Datasheet(PDF) 16 Page - Texas Instruments |
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ISO7340C Datasheet(HTML) 16 Page - Texas Instruments |
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16 / 34 page ![]() ISO7340C, ISO7340FC, ISO7341C, ISO7341FC, ISO7342C, ISO7342FC SLLSEI6E – SEPTEMBER 2014 – REVISED APRIL 2015 www.ti.com 8.3 Feature Description ISO734x are available in multiple channel configurations and default output state options to enable wide variety of application uses. PRODUCT CHANNEL DIRECTION RATED ISOLATION MAX DATA RATE DEFAULT OUTPUT ISO7340C 4 Forward, High 0 Reverse ISO7340FC Low ISO7341C 3 Forward, High 3000 VRMS / 4242 VPK (1) 25 Mbps 1 Reverse ISO7341FC Low ISO7342C 2 Forward, High 2 Reverse ISO7342FC Low (1) See the Regulatory Information section for detailed isolation ratings. 8.3.1 High Voltage Feature Description 8.3.1.1 Insulation and Safety-Related Specifications for DW-16 Package over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT L(I01) Minimum air gap (clearance) Shortest terminal-to-terminal distance through air 8 mm Minimum external tracking Shortest terminal-to-terminal distance across the L(I02) 8 mm (creepage) package surface Tracking resistance (comparative CTI DIN EN 60112 (VDE 0303-11); IEC 60112 400 V tracking index) Minimum internal gap (internal DTI Distance through the insulation 13 µm clearance) VIO = 500 V, TA = 25°C 1012 Isolation resistance, input to RIO Ω output(1) VIO = 500 V, 100°C ≤ TA ≤ 125°C 1011 Isolation capacitance, input to CIO VIO = 0.4 sin (2πft), f = 1 MHz 2.4 pF output(1) CI Input capacitance(2) VI = VCC/2 + 0.4 sin (2πft), f = 1 MHz, VCC = 5 V 3.4 pF (1) All pins on each side of the barrier tied together creating a two-terminal device. (2) Measured from input pin to ground. NOTE Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed-circuit board do not reduce this distance. Creepage and clearance on a printed-circuit board become equal in certain cases. Techniques such as inserting grooves and/or ribs on a printed circuit board are used to help increase these specifications. 16 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ISO7340C ISO7340FC ISO7341C ISO7341FC ISO7342C ISO7342FC |
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