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ISO7340C Datasheet(PDF) 16 Page - Texas Instruments

Part # ISO7340C
Description  ISO734x Robust EMC, Low Power, Quad-Channel Digital Isolators
PDF  34 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

ISO7340C Datasheet(HTML) 16 Page - Texas Instruments

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ISO7340C, ISO7340FC, ISO7341C, ISO7341FC, ISO7342C, ISO7342FC
SLLSEI6E – SEPTEMBER 2014 – REVISED APRIL 2015
www.ti.com
8.3 Feature Description
ISO734x are available in multiple channel configurations and default output state options to enable wide variety
of application uses.
PRODUCT
CHANNEL DIRECTION
RATED ISOLATION
MAX DATA RATE
DEFAULT OUTPUT
ISO7340C
4 Forward,
High
0 Reverse
ISO7340FC
Low
ISO7341C
3 Forward,
High
3000 VRMS / 4242 VPK
(1)
25 Mbps
1 Reverse
ISO7341FC
Low
ISO7342C
2 Forward,
High
2 Reverse
ISO7342FC
Low
(1)
See the Regulatory Information section for detailed isolation ratings.
8.3.1 High Voltage Feature Description
8.3.1.1 Insulation and Safety-Related Specifications for DW-16 Package
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
L(I01)
Minimum air gap (clearance)
Shortest terminal-to-terminal distance through air
8
mm
Minimum external tracking
Shortest terminal-to-terminal distance across the
L(I02)
8
mm
(creepage)
package surface
Tracking resistance (comparative
CTI
DIN EN 60112 (VDE 0303-11); IEC 60112
400
V
tracking index)
Minimum internal gap (internal
DTI
Distance through the insulation
13
µm
clearance)
VIO = 500 V, TA = 25°C
1012
Isolation resistance, input to
RIO
Ω
output(1)
VIO = 500 V, 100°C ≤ TA ≤ 125°C
1011
Isolation capacitance, input to
CIO
VIO = 0.4 sin (2πft), f = 1 MHz
2.4
pF
output(1)
CI
Input capacitance(2)
VI = VCC/2 + 0.4 sin (2πft), f = 1 MHz, VCC = 5 V
3.4
pF
(1)
All pins on each side of the barrier tied together creating a two-terminal device.
(2)
Measured from input pin to ground.
NOTE
Creepage and clearance requirements should be applied according to the specific
equipment isolation standards of an application. Care should be taken to maintain the
creepage and clearance distance of a board design to ensure that the mounting pads of
the isolator on the printed-circuit board do not reduce this distance.
Creepage and clearance on a printed-circuit board become equal in certain cases.
Techniques such as inserting grooves and/or ribs on a printed circuit board are used to
help increase these specifications.
16
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Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: ISO7340C ISO7340FC ISO7341C ISO7341FC ISO7342C ISO7342FC



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