LM2775

SNVSA57 – MAY 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN, VOUT

–0.3

6

V

EN, OUTDIS, PFM

–0.3

V

Continuous power dissipation

Internally Limited

°C

125

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

±1000

Electrostatic

V

discharge

±250

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

2.7

5.5

V

–40

125

°C

–40

85

°C

6.4 Thermal Information

LM2775

DSG (WSON)

UNIT

8 PINS

Junction-to-ambient thermal resistance

71.6

Junction-to-case (top) thermal resistance

95.0

Junction-to-board thermal resistance

41.5

°C/W

Junction-to-top characterization parameter

3.2

Junction-to-board characterization parameter

41.8

Junction-to-case (bottom) thermal resistance

12.8

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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