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AX5042 Datasheet(PDF) 39 Page - ON Semiconductor |
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AX5042 Datasheet(HTML) 39 Page - ON Semiconductor |
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39 / 42 page ![]() QFN28 Package Information www.onsemi.com AX5042 39 39 8.2. QFN28 Soldering Profile Profile Feature Pb-Free Process Average Ramp-Up Rate 3 °C/sec max. Preheat Preheat Temperature Min TsMIN 150°C Temperature Max TsMAX 200°C Time (TsMIN to TsMAX) ts 60 – 180 sec Time 25°C to Peak Temperature T25 ° to Peak 8min max. Reflow Phase Liquidus Temperature TL 217°C Time over Liquidus Temperature tL 60 – 150 sec Peak Temperature tp 260°C Time within 5°C of actual Peak Temperature Tp 20 – 40 sec Cooling Phase Ramp-down rate 6°C/sec max. Notes: All temperatures refer to the top side of the package, measured on the package body surface. Time Tp TL TsMAX TsMIN t25° to Peak ts tL 25°C Preheat Reflow Cooling tp |
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