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INA300 Datasheet(PDF) 4 Page - Texas Instruments |
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INA300 Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 33 page ![]() INA250A1, INA250A2, INA250A3, INA250A4 SBOS511B – APRIL 2015 – REVISED DECEMBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage (VS) 40 V Analog input current Continuous current ±15 A Analog inputs (IN+, IN–) Common-mode GND – 0.3 40 V Common-mode GND – 0.3 40 Analog inputs (VIN+, VIN–) V Differential (VIN+) – (VIN–) –40 40 Analog inputs (REF) GND – 0.3 VS + 0.3 V Analog outputs (SH+, SH–) Common-mode GND – 0.3 40 V Analog outputs (OUT) GND – 0.3 (VS + 0.3) up to 18 V Operating, TA –55 150 Temperature Junction, TJ 150 °C Storage, Tstg –65 150 (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions MIN NOM MAX UNIT VCM Common-mode input voltage 0 36 V VS Operating supply voltage 2.7 36 V TA Operating free-air temperature –40 125 °C 6.4 Thermal Information INA250 THERMAL METRIC(1) PW (TSSOP) UNIT 16 PINS RθJA Junction-to-ambient thermal resistance 104.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 42.3 °C/W RθJB Junction-to-board thermal resistance 48.5 °C/W ψJT Junction-to-top characterization parameter 4.5 °C/W ψJB Junction-to-board characterization parameter 48 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: INA250A1 INA250A2 INA250A3 INA250A4 |
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