Data Sheet

AD8283

Rev. C | Page 27 of 27

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VNND-4

0.20 REF

0.90

0.85

0.80

0.70

0.65

0.60

0.05 MAX

0.01 NOM

1

18

54

37

19

36

72

55

0.50

0.40

0.30

8.50 REF

PIN 1

INDICATOR

SEATING

PLANE

12° MAX

0.60

0.42

0.24

0.60

0.42

0.24

0.30

0.23

0.18

0.50

BSC

PIN 1

INDICATOR

COPLANARITY

0.08

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

TOP VIEW

EXPOSED

PAD

BOTTOM VIEW

10.10

10.00 SQ

9.90

9.85

9.75 SQ

9.65

0.25 MIN

8.60

8.50 SQ

8.40

Figure 35. 72-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

10 mm × 10 mm Body, Very Thin Quad

(CP-72-5)

Dimensions shown in millimeters

ORDERING GUIDE

Model1, 2, 3

Temperature Range

Package Description

Package Option

AD8283WBCPZ-RL

−40°C to +105°C

72-LeadLFCSP_VQ, 13”Tape and Reel

CP-72-5

AD8283WBCPZ

−40°C to +105°C

72-LeadLFCSP_VQ, Waffle Pack

CP-72-5

AD8283CP-EBZ

Evaluation Board

1

Z = RoHS Compliant Part.

2

W = Qualified for Automotive Applications.

3

Compliant to JEDEC Standard MO-220-VNND-4.

AUTOMOTIVE PRODUCTS

The AD8283WBCPZ models are available with controlled manufacturing to support the quality and reliability requirements of

automotive applications. Note that these automotive models may have specifications that differ from the commercial models; therefore,

designers should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for

use in automotive applications. Contact your local Analog Devices account representative for specific product ordering information and

to obtain the specific Automotive Reliability reports for this model.

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registered trademarks are the property of their respective owners.

D09795-0-8/15(C)