FX021 datasheet(2/20 Pages) TI1

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CSD97374Q4M

SLPS382C – JANUARY 2013 – REVISED JULY 2013

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS

(1)

TA = 25°C (unless otherwise noted)

VALUE

UNIT

MIN

MAX

VIN to PGND

-0.3

VSW to PGND , VIN to VSW

-0.3

VSW to PGND, VIN to VSW (<10ns)

-7

VDD to PGND

–0.3

PWM, SKIP# to PGND

–0.3

BOOT to PGND

–0.3

BOOT to PGND (<10ns)

-2

BOOT to BOOT_R

–0.3

Human Body Model (HBM)

2000

ESD Rating

Charged Device Model (CDM)

500

Power Dissipation, PD

Operating Temperature Range, TJ

-40

150

°C

Storage Temperature Range, TSTG

–55

150

°C

(1)

Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only

and functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating

Conditions" is not implied. Exposure to Absolute Maximum rated conditions for extended periods may affect device reliability.

RECOMMENDED OPERATING CONDITIONS

TA = 25° (unless otherwise noted)

Parameter

Conditions

MIN

MAX

UNIT

Gate Drive Voltage, VDD

4.5

5.5

Input Supply Voltage, VIN

Continuous Output Current, IOUT

VIN = 12V, VDD = 5V, VOUT = 1.8V,

fSW = 500kHz, LOUT = 0.29µH

(1)

Peak Output Current, IOUT-PK

(2)

Switching Frequency, fSW

CBST = 0.1µF (min)

2000

kHz

On Time Duty Cycle

Minimum PWM On Time

Operating Temperature

–40

125

°C

(1)

Measurement made with six 10-µF (TDK C3216X5R1C106KT or equivalent) ceramic capacitors placed across VIN to PGND pins.

(2)

System conditions as defined in Note 1. Peak Output Current is applied for tp = 10ms, duty cycle ≤ 1%

THERMAL INFORMATION

TA = 25°C (unless otherwise noted)

PARAMETER

MIN

TYP

MAX

UNIT

RθJC

Thermal Resistance, Junction-to-Case (Top of package)(1)

22.8

°C/W

RθJB

Thermal Resistance, Junction-to-Board(2)

2.5

°C/W

(1)

RθJC is determined with the device mounted on a 1-inch² (6.45 -cm²), 2-oz (.071-mm thick) Cu pad on a 1.5-inch x 1.5-inch, 0.06-inch

(1.52-mm) thick FR4 board.

(2)

RθJB value based on hottest board temperature within 1mm of the package.

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