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OPA621 Datasheet(PDF) 4 Page - Texas Instruments |
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OPA621 Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 17 page ![]() ® OPA621 4 OPA621 Basic Model Number Performance Grade Code K = –40 °C to +85°C Package Code P = 8-pin Plastic DIP U = 8-pin Plastic SO-8 PIN CONFIGURATION 1 2 3 4 8 7 6 5 No Internal Connection Positive Supply (+V ) Output No Internal Connection No Internal Connection Inverting Input Non-Inverting Input Negative Supply (–V ) CC CC ORDERING INFORMATION Top View DIP/SO-8 ABSOLUTE MAXIMUM RATINGS NOTE: (1) Packages must be derated based on specified θ JA. Maximum TJ must be observed. Supply ............................................................................................. ±7VDC Internal Power Dissipation(1) .......................... See Applications Information Differential Input Voltage ............................................................. Total VCC Input Voltage Range .................................... See Applications Information Storage Temperature Range KP, KU: ............................ –40 °C to +125°C Lead Temperature (soldering, 10s) ............................................... +300 °C (soldering, SO-8 3s) ........................................ +260 °C Output Short Circuit to Ground (+25 °C) .................. Continuous to Ground Junction Temperature (TJ ) ............................................................ +175°C PACKAGE DRAWING PRODUCT PACKAGE NUMBER(1) OPA621KP 8-Pin Plastic DIP 006 OPA621KU 8-Pin SO-8 182 NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. PACKAGE INFORMATION ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. () () |
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