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LTC1874 Datasheet(PDF) 11 Page - Linear Technology |
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LTC1874 Datasheet(HTML) 11 Page - Linear Technology |
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11 / 12 page ![]() 11 LTC1874 PC Board Layout Checklist When laying out the printed circuit board, the following checklist should be used to ensure proper operation of the LTC1874. These items are illustrated graphically for a single controller in the layout diagram in Figure 6. Check the following in your layout: 1. Is the Schottky diode closely connected between power ground (PGND) and the drain of the external MOSFET? 2. Does the (+) plate of CIN connect to the sense resistor as closely as possible? This capacitor provides AC current to the MOSFET. 3. Is the input decoupling capacitor (0.1 µF) connected closely between VIN and signal ground (GND)? 4. Connect the end of RSENSE as close to VIN as possible. The VIN pin is the SENSE+ of the current comparator. 5. Is the trace from SENSE– to the SENSE resistor kept short? Does the trace connect close to RSENSE? 6. Keep the switching node PGATE away from sensitive small signal nodes. 7. Does the VFB pin connect directly to the feedback resistors? The resistive divider R1 and R2 must be connected between the (+) plate of COUT and signal ground. 8. PVIN must connect to VIN and PGND must connect to GND. Isolate high current power paths from signal power and signal ground where possible in the layout. An unbroken ground plane is recommended. Figure 6. LTC1874 Layout Diagram (See PC Board Layout Checklist) VIN SENSE– GND VFB 16 15 14 13 1 2 3 4 PVIN PGATE PGND ITH/RUN 1/2 LTC1874 0.1 µF RSENSE CIN COUT VOUT VIN D1 L1 M1 SW RITH CITH 1874 F06 + R2 BOLD LINES INDICATE HIGH CURRENT PATHS R1 + APPLICATIO S I FOR ATIO Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. |
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