MAX5590 datasheet(31/33 Pages) MAXIM

31 / 33 page

Buffered, Fast-Settling, Octal, 12/10/8-Bit,

Voltage-Output DACs

______________________________________________________________________________________

Power-Supply and Layout Considerations

Bypass the analog and digital power supplies by using a

10µF capacitor in parallel with a 0.1µF capacitor to AGND

and DGND (Figure 10). Minimize lead lengths to reduce

lead inductance. Use shielding and/or ferrite beads to fur-

ther increase isolation.

Digital and AC transient signals coupling to AGND can

create noise at the output. Connect AGND to the high-

est quality ground available. Use proper grounding

techniques, such as a multilayer board with a low-

inductance ground plane. Wire-wrapped boards and

sockets are not recommended. For optimum system

performance, use PC boards with separate analog and

digital ground planes. Connect the two ground planes

together at the low-impedance power-supply source.

Using separate power supplies for AVDD and DVDD

improves noise immunity. Connect AGND and DGND at

the low-impedance power-supply sources (Figure 11).

MAX5590–MAX5595

VREF

µF*

0.1

µF*

REF

SCLK

DIN

UPIO1

UPIO2

DSP

AGND**

DGND**

OUTA

FBA

FBH

OUTH

MAX5591

MAX5593

MAX5595

ONLY

µF

0.1

µF

0.1

µF

DVDD

AVDD

DVDD

AVDD

*REMOVE BYPASS CAPACITORS ON REF FOR AC-REFERENCE INPUTS.

**CONNECT ANALOG AND DIGITAL GROUND PLANES AT THE

LOW-IMPEDANCE POWER-SUPPLY SOURCE.

Figure 10. Bypassing Power Supplies AVDD, DVDD, and REF

MAX5590–MAX5595

0.1

µF

AVDD

AGND

AVDD

AGND

0.1

µF

DVDD

DGND

DVDD

DGND

DVDD

DGND

ANALOG SUPPLY

DIGITAL SUPPLY

DIGITAL

CIRCUITRY

Figure 11. Separate Analog and Digital Power Supplies

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