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HCPL3180 Datasheet(PDF) 1 Page - Agilent(Hewlett-Packard)

Part # HCPL3180
Description  Current, High Speed IGBT/MOSFET Gate Drive Optocoupler
PDF  19 Pages
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Manufacturer  HP [Agilent(Hewlett-Packard)]
Direct Link  http://www.home.agilent.com
Logo HP - Agilent(Hewlett-Packard)

HCPL3180 Datasheet(HTML) 1 Page - Agilent(Hewlett-Packard)

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Agilent HCPL-3180 2 Amp Output
Current, High Speed IGBT/MOSFET Gate
Drive Optocoupler
Data Sheet
Description
This family of devices consists of
a GaAsP LED. The LED is
optically coupled to an
integrated circuit with a power
stage. These optocouplers are
ideally suited for high frequency
driving of power IGBT and
MOSFETs used in Plasma
Display Panels, high
performance DC/DC convertors
and motor control invertor
applications.
Ordering Information
Specify part number followed by
option number (if desired):
Example : HCPL-3180-XXX
Features
• 2 A minimum peak output current
• 250 KHz maximum switching
speed
• High speed response: 200 ns max
Propagation delay over
temperature range
• 10 KV/us minimum common mode
rejection (CMR) at VCM=1500 V
• Under voltage lockout protection
(UVLO) with hysteresis
• Wide operating temperature
range: -40 °C to +100 °C
• Wide VCC operating range:
10 V to 20 V
• 20 ns typ pulse width distortion
• Safety Approvals:
UL approval pending
3750 VRMS for 1 minute.
CSA approval
DIN EN 60747-5-2 approval
pending
Applications
• Plasma Display Panel (PDP)
• Distributed power architecture
(DPA)
• Switch mode rectifier (SMR)
• High performance DC/DC
convertor
• High performance switch mode
power supply (SMPS)
• High performance uninterruptible
power supply (UPS)
• Isolated IGBT/Power MOSFET
gate drive
No option = Standard DIP
package, 50 per tube.
300 = Gull Wing Surface Mount
Option, 50 per tube.
500 = Tape and Reel Packaging
Option.
060 = DIN EN 60747-5-2 Option,
VIORM=630 Vpeak (pending
approval)
N/C
ANODE
CATHODE
N/C
V
CC
V
O
V
EE
1
6
3
4
27
8
5
V
O
Functional Diagram
A 0.1 uF bypass capacitor must be connected between pins 5 and 8.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/
or degradation which may be induced by ESD.


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