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HCPL3180 Datasheet(PDF) 3 Page - Agilent(Hewlett-Packard) |
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HCPL3180 Datasheet(HTML) 3 Page - Agilent(Hewlett-Packard) |
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3 / 19 page ![]() 3 0 TIME (SECONDS) 200 100 50 150 100 200 250 300 0 30 SEC. 50 SEC. 30 SEC. 160˚C 140˚C 150˚C PEAK TEMP. 245˚C PEAK TEMP. 240˚C PEAK TEMP. 230˚C SOLDERING TIME 200˚C PREHEATING TIME 150˚C, 90 + 30 SEC. 2.5˚C ± 0.5˚C/SEC. 3˚C + 1˚C/–0.5˚C TIGHT TYPICAL LOOSE ROOM TEMPERATURE PREHEATING RATE 3˚C + 1˚C/–0.5˚C/SEC. REFLOW HEATING RATE 2.5˚C ± 0.5˚C/SEC. Solder Reflow Temperature Profile Regulatory Information The HCPL-3180 is pending approval by the following organizations: DIN EN 60747-5-2 Pending approval under DIN EN-60747-5-2 with VIORM = 630 VPEAK UL Approval under UL 1577, component recognition program up to VISO = 2500 VRMS. Pending 3750 VRMS. CSA Approval under CSA Component. |
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