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AD9219

Data Sheet

Rev. E | Page 10 of 56

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

With

Respect To

Rating

ELECTRICAL

AVDD

AGND

−0.3 V to +2.0 V

DRVDD

DRGND

−0.3 V to +2.0 V

AGND

DRGND

−0.3 V to +0.3 V

AVDD

DRVDD

−2.0 V to +2.0 V

Digital Outputs

(D + x, D − x, DCO+,

DCO−, FCO+, FCO−)

DRGND

−0.3 V to +2.0 V

CLK+, CLK−

AGND

−0.3 V to +3.9 V

VIN + x, VIN − x

AGND

−0.3 V to +2.0 V

SDIO/ODM

AGND

−0.3 V to +2.0 V

PDWN, SCLK/DTP, CSB

AGND

−0.3 V to +3.9 V

REFT, REFB, RBIAS

AGND

−0.3 V to +2.0 V

VREF, SENSE

AGND

−0.3 V to +2.0 V

ENVIRONMENTAL

Operating Temperature

Range (Ambient)

−40°C to +85°C

Maximum Junction

Temperature

150°C

Lead Temperature

(Soldering, 10 sec)

300°C

Storage Temperature

Range (Ambient)

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL IMPEDANCE

Table 6.

Air Flow Velocity (m/sec)

θJA1

θJB

θJC

Unit

0.0

°C/W

1.0

12.6

1.2

°C/W

2.5

°C/W

1 θJA for a 4-layer PCB with solid ground plane (simulated). Exposed pad

soldered to PCB.

ESD CAUTION

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