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DA6102

6-Channel High Efficiency PMIC for 2-Cell Systems

Datasheet

Revision 2.1

28-Apr-2017

3 of 82

Contents

General Description ............................................................................................................................ 1

Key Features ........................................................................................................................................ 1

Applications ......................................................................................................................................... 1

System Diagram .................................................................................................................................. 2

Contents ............................................................................................................................................... 3

Figures.................................................................................................................................................. 4

Tables ................................................................................................................................................... 4

Pinout ............................................................................................................................................. 6

Absolute Maximum Ratings ......................................................................................................... 9

Recommended Operating Conditions....................................................................................... 10

Electrical Characteristics ........................................................................................................... 10

Timing Characteristics................................................................................................................ 17

Thermal Characteristics ............................................................................................................. 17

Typical Performance ................................................................................................................... 18

Typical Schematic ....................................................................................................................... 22

Functional Description ............................................................................................................... 23

9.1

General................................................................................................................................ 23

9.2

Always-on LDOs and Internal Load Switches..................................................................... 23

9.3

ENABLE, UVLO, and Operating State Transitions ............................................................. 27

9.4

Sequencer and Soft-start .................................................................................................... 28

9.5

Channel 1 to Channel 4, Common Features and Functionality .......................................... 31

9.6

Channel 1, BuckBoost Regulator ........................................................................................ 37

9.7

Channels 2 and 4, Buck Regulators ................................................................................... 37

9.8

Channel 3, Buck Controller ................................................................................................. 38

9.9

Inductors, Output Capacitors, and Input Capacitors ........................................................... 39

9.10 CS1, CS2, and CS3: Current Sense and Load Switches ................................................... 40

9.11 External LDO Control .......................................................................................................... 42

9.12 PGOOD and FAULT Handling ............................................................................................ 42

9.13 VDDIO and VCORE ............................................................................................................ 46

9.14 I

2C Communication ............................................................................................................. 46

9.15 PCB Layout Guidelines ....................................................................................................... 50

10 Register Definitions .................................................................................................................... 52

10.1 Register Map ....................................................................................................................... 52

10.2 Register Details ................................................................................................................... 54

Appendix A

Optimizing Transient Performance .................................................................. 76

11 Package Information ................................................................................................................... 80

11.1 Package Outlines ................................................................................................................ 80

11.2 Moisture Sensitivity Level.................................................................................................... 80

11.3 Soldering Information .......................................................................................................... 80

12 Ordering Information .................................................................................................................. 81

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