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LTC7813 Datasheet(PDF) 10 Page - Linear Technology |
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LTC7813 Datasheet(HTML) 10 Page - Linear Technology |
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10 / 36 page ![]() LTC7821 10 Rev A For more information www.analog.com TEMP (Pin 12): Temperature Sensing Input. Using a PTC resistor as the lower leg of a resistor divider, connect the TEMP pin to the common point of the divider. The PTC resistor is used to monitor a hot spot on the PCB. Once it reaches the TEMP threshold of 1.22V, the LTC7821 stops switching for 100ms before retrying. Ground this pin if not used. VFB (Pin 13): Error Amplifier Feedback Input. This pin receives the remotely sensed feedback voltage from an external resistive divider across the output. ISNS– (Pin 14): Current Sense Comparator Input. The (–) input to the current comparator is Kelvin connected to the output voltage of the controller. ISNS+ (Pin 15): Current Sense Comparator Input. The (+) input to the current comparator is normally Kelvin con- nected to the DCR sensing networks or current sensing resistor. EXTVCC (Pin 16): External Power Input to an Internal LDO Connected to INTVCC. This LDO supplies INTVCC power, bypassing the internal LDO powered from VIN whenever EXTVCC is higher than 6.4V. Do not float or exceed 40V on this pin. PGND (Pin 17): Driver Power Ground. Connect this pin closely to the source of bottom (synchronous) N-channel MOSFET M4, the (–) terminal of CIN and the (–) terminal of CVCC. BG2 (Pin 18): Gate Drive for the Bottom (synchronous) N-Channel MOSFET. The voltage swings from slightly below ground to INTVCC. INTVCC (Pin 19): Internal Regulator Output. The bottom synchronous gate driver and control circuits are powered fromthisregulator.BypassthispintoPGNDwithaminimum of 4.7μF low ESR tantalum or ceramic capacitor. Do not use the INTVCC pin for any purpose other than described in this data sheet. SW3 (Pin 20): Switch Node Connection to Inductor and One Terminal of Flying Capacitor. Voltage swing at this pin is from slightly below ground to VIN/2. TG2 (Pin 21): Floating Gate Drive for Second Lowermost N-Channel MOSFET. The voltage swings equal to INTVCC superimposed on the switch node voltage SW3. BOOST1,BOOST2,BOOST3(Pin31,23,22):Bootstrapped Supplies to Floating Drivers. Capacitors are connected between the BOOSTx and SWx (MID) pin. Voltage swing at the BOOST1 pin is from (VIN/2 + INTVCC) to (VIN + IN- TVCC). Voltage at the BOOST2 pin is at (VIN/2 + INTVCC). Voltage swing at the BOOST3 pin is from INTVCC to (VIN/2 + INTVCC). BG1 (Pin 24): Floating Gate Drive for Second Uppermost N-Channel MOSFET. The voltage swings between (VIN/2 + INTVCC) and VIN/2. MID (Pin 25): Half Supply from VIN. Do not use this to source current. Connect a bypass capacitor from this node to PGND. MIDSENSE (Pin 26): Half Supply Monitor. Provides Kelvin sensing input for the comparator that monitors the voltage between MIDSENSE and ground. An RC filter can be added from MID to this pin to filter out noise. VIN_SENSE (Pin 27): VIN Kelvin Sensing Input. Allows an internal VIN/2 to be generated for LTC7821 control circuit usage. For a cleaner supply, an RC filter can be added from VIN to this pin. VIN (Pin 28): Main Input Supply. Bypass this pin to PGND with a capacitor. SW1 (Pin 29): Switch Node Connection to One Terminal of Flying Capacitor. Voltage swing at this pin is from VIN/2 voltage to VIN. TG1(Pin30):FloatingGateDriveforUppermostN-Channel MOSFET.ThevoltageswingsequaltoINTVCCsuperimposed on the switch node voltage SW1. SGND (Exposed Pad, Pin 33): Signal Ground. All Small- signalcomponentsandcompensationcomponentsshould connect to this ground, which in turn connects to PGND at one point. Exposed pad must be soldered to the PCB, providing a local ground for the control components of the IC, and be tied to the PGND pin under the IC. PIN FUNCTIONS |
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