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LTC7813 Datasheet(PDF) 10 Page - Linear Technology

Part # LTC7813
Description  Hybrid Step-Down Synchronous Controller
PDF  36 Pages
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Manufacturer  LINER [Linear Technology]
Direct Link  http://www.linear.com
Logo LINER - Linear Technology

LTC7813 Datasheet(HTML) 10 Page - Linear Technology

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LTC7821
10
Rev A
For more information www.analog.com
TEMP (Pin 12): Temperature Sensing Input. Using a PTC
resistor as the lower leg of a resistor divider, connect the
TEMP pin to the common point of the divider. The PTC
resistor is used to monitor a hot spot on the PCB. Once
it reaches the TEMP threshold of 1.22V, the LTC7821
stops switching for 100ms before retrying. Ground this
pin if not used.
VFB (Pin 13): Error Amplifier Feedback Input. This pin
receives the remotely sensed feedback voltage from an
external resistive divider across the output.
ISNS– (Pin 14): Current Sense Comparator Input. The (–)
input to the current comparator is Kelvin connected to the
output voltage of the controller.
ISNS+ (Pin 15): Current Sense Comparator Input. The (+)
input to the current comparator is normally Kelvin con-
nected to the DCR sensing networks or current sensing
resistor.
EXTVCC (Pin 16): External Power Input to an Internal LDO
Connected to INTVCC. This LDO supplies INTVCC power,
bypassing the internal LDO powered from VIN whenever
EXTVCC is higher than 6.4V. Do not float or exceed 40V
on this pin.
PGND (Pin 17): Driver Power Ground. Connect this pin
closely to the source of bottom (synchronous) N-channel
MOSFET M4, the (–) terminal of CIN and the (–) terminal
of CVCC.
BG2 (Pin 18): Gate Drive for the Bottom (synchronous)
N-Channel MOSFET. The voltage swings from slightly
below ground to INTVCC.
INTVCC (Pin 19): Internal Regulator Output. The bottom
synchronous gate driver and control circuits are powered
fromthisregulator.BypassthispintoPGNDwithaminimum
of 4.7μF low ESR tantalum or ceramic capacitor. Do not
use the INTVCC pin for any purpose other than described
in this data sheet.
SW3 (Pin 20): Switch Node Connection to Inductor and
One Terminal of Flying Capacitor. Voltage swing at this pin
is from slightly below ground to VIN/2.
TG2 (Pin 21): Floating Gate Drive for Second Lowermost
N-Channel MOSFET. The voltage swings equal to INTVCC
superimposed on the switch node voltage SW3.
BOOST1,BOOST2,BOOST3(Pin31,23,22):Bootstrapped
Supplies to Floating Drivers. Capacitors are connected
between the BOOSTx and SWx (MID) pin. Voltage swing
at the BOOST1 pin is from (VIN/2 + INTVCC) to (VIN + IN-
TVCC). Voltage at the BOOST2 pin is at (VIN/2 + INTVCC).
Voltage swing at the BOOST3 pin is from INTVCC to (VIN/2
+ INTVCC).
BG1 (Pin 24): Floating Gate Drive for Second Uppermost
N-Channel MOSFET. The voltage swings between (VIN/2
+ INTVCC) and VIN/2.
MID (Pin 25): Half Supply from VIN. Do not use this to
source current. Connect a bypass capacitor from this
node to PGND.
MIDSENSE (Pin 26): Half Supply Monitor. Provides Kelvin
sensing input for the comparator that monitors the voltage
between MIDSENSE and ground. An RC filter can be added
from MID to this pin to filter out noise.
VIN_SENSE (Pin 27): VIN Kelvin Sensing Input. Allows an
internal VIN/2 to be generated for LTC7821 control circuit
usage. For a cleaner supply, an RC filter can be added
from VIN to this pin.
VIN (Pin 28): Main Input Supply. Bypass this pin to PGND
with a capacitor.
SW1 (Pin 29): Switch Node Connection to One Terminal
of Flying Capacitor. Voltage swing at this pin is from VIN/2
voltage to VIN.
TG1(Pin30):FloatingGateDriveforUppermostN-Channel
MOSFET.ThevoltageswingsequaltoINTVCCsuperimposed
on the switch node voltage SW1.
SGND (Exposed Pad, Pin 33): Signal Ground. All Small-
signalcomponentsandcompensationcomponentsshould
connect to this ground, which in turn connects to PGND
at one point. Exposed pad must be soldered to the PCB,
providing a local ground for the control components of
the IC, and be tied to the PGND pin under the IC.
PIN FUNCTIONS



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