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AS3956 Datasheet(PDF) 7 Page - ams AG |
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AS3956 Datasheet(HTML) 7 Page - ams AG |
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7 / 109 page ![]() ams Datasheet Page 7 [v1-10] 2018-Apr-27 Document Feedback AS3956 − Pin Assignment Pin Description Figure 5: Pin Description Note(s): 1. Pin meas is not bonded in MLPD package. It is only used during wafer sort test. 10-pin MLPD 10-pin WL-CSP Die Pin Name Pin Type Description NA NA 1 meas Analog I/O Analog test pin (1) 1 C4 2 VP_IO Supply Pad Positive supply of the interface / IC 2B1 3 VP_REG Analog Output Regulator output 3C3 4 LC1 Analog I/O Connection to tag coil 4 C2 5 LC2 Connection to tag coil 5 C1 6 VSS Supply Pad Ground, die substrate potential 6A1 9 /SS Digital Input SPI enable (active low) / I²C interface enable 7 A3 10 SCLK / SCL SPI / I²C clock 8A2 11 MOSI SPI data input 9A4 12 MISO / SDA Digital Output / Tristate SPI data output / I²C data line 10 B4 13 IRQ Digital Output Interrupt request output (active high) |
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