EL4342 datasheet(8/14 Pages) RENESAS

8 / 14 page

EL4340, EL4342

FN7421 Rev.4.00

Page 8 of 14

Oct 4, 2017

FIGURE 17. HIZ SWITCHING GLITCH VIN = 0V

FIGURE 18. HIZ TRANSIENT RESPONSE VIN = 1V

FIGURE 19. INPUT NOISE vs FREQUENCY (OUTPUT A, B, C)

FIGURE 20. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

FIGURE 21. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE

Typical Performance Curves V

S = ±5V, RL = 500Ω to GND, TA = +25°C, unless otherwise specified. (Continued)

10ns/DIV

VIN = 0V

VOUT A, B, C

HIZ

50Ω

TERM.

VIN = 1V

10ns/DIV

VOUT A, B, C

50Ω

TERM.

HIZ

100

10k

100k

FREQUENCY (Hz)

JEDEC JESD51-7 HIGH EFFECTIVE THERMAL

CONDUCTIVITY TEST BOARD-QFN EXPOSED

DIEPAD SOLDERED TO PCB PER JESD51-5

3.0

2.5

2.0

1.5

1.0

0.5

100

150

AMBIENT TEMPERATURE (°C)

JA = 35°C/W

QFN32

125

JA = 88°C/W

QSOP24

1.136W

2.857W

JEDEC JESD51-3 LOW EFFECTIVE THERMAL

CONDUCTIVITY TEST BOARD

1.2

1.0

0.8

0.6

0.4

0.2

100

150

AMBIENT TEMPERATURE (°C)

125

JA = 125°C/W

QFN32

JA = 115°C/W

QSOP24

870mW

758mW

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