RT8152C datasheet(11/24 Pages) RICHTEK

11 / 24 page

RT8152C/D

DS8152C/D-04

April 2011

www.richtek.com

Note 1. Stresses listed as the above

“Absolute Maximum Ratings” may cause permanent damage to the device. These are for

stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the

operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended

periods may remain possibility to affect device reliability.

Note 2.

θJA is measured in the natural convection at TA = 25°C on a high effective four layers thermal conductivity test board of

JEDEC 51-7 thermal measurement standard. The case point of

θJC is on the expose pad for the package.

Note 3. Devices are ESD sensitive. Handling precaution is recommended.

Note 4. The device is not guaranteed to function outside its operating conditions.

Note 5. Guaranteed by design.

Parameter

Symbol

Test Conditions

Min

Typ

Max

Unit

Gate Driver

Upper Driver Source

RUGATEsr

VBOOT − VPHASE = 5V

VBOOT − VUGATE = 1V

0.7

Upper Driver Sink

RUGATEsk

VUGATE = 1V

0.6

Lower Driver Source

RLGATEsr

VPVDD = 5V, VPVDD − VLGATE = 1V

0.75

Lower Driver Sink

RLGATEsk

VLGATE = 1V

0.5

Upper Driver Source/Sink

Current

IUGATE

VBOOT −VPHASE = 5V

VUGATE = 2.5V

Lower Driver Source

Current

ILGATEsr

VLGATE = 2.5V

Lower Driver Sink Current ILGATEsk

VLGATE = 2.5V

Internal Boot Charging

Switch On-Resistance

RBOOT

PVDD to BOOT

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