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OPA855 Datasheet(PDF) 4 Page - Texas Instruments |
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OPA855 Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 33 page ![]() 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT VS Total supply voltage (VS+ – VS– ) 5.5 V VIN+, VIN– Input voltage (VS–) – 0.5 (VS+) + 0.5 V VID Differential input voltage 1 V VOUT Output voltage (VS–) – 0.5 (VS+) + 0.5 V IIN Continuous input current ±10 mA IOUT Continuous output current(2) ±100 mA TJ Junction temperature 150 °C TA Operating free-air temperature –40 125 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Long-term continuous output current for electromigration limits. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/ JEDEC JS-001, all pins(1) ±1500 V Charged device model (CDM), per JEDEC specification JS-002, all pins(2) ±1500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VS Total supply voltage (VS+ – VS– ) 3.3 5 5.25 V TA Operating free-air temperature –40 125 °C 7.4 Thermal Information THERMAL METRIC(1) OPA856 UNIT DSG (WSON) 8 PINS RθJA Junction-to-ambient thermal resistance 80.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 100 °C/W RθJB Junction-to-board thermal resistance 45 °C/W ΨJT Junction-to-top characterization parameter 6.8 °C/W ΨJB Junction-to-board characterization parameter 45.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 22.7 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. OPA856 SBOS623 – OCTOBER 2020 www.ti.com 4 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: OPA856 |
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