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DRV8300DI Datasheet(PDF) 6 Page - Texas Instruments |
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DRV8300DI Datasheet(HTML) 6 Page - Texas Instruments |
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6 / 27 page ![]() 7 Specifications 7.1 Absolute Maximum Ratings over operating temperature range (unless otherwise noted)(1) MIN MAX UNIT Gate driver regulator pin voltage GVDD -0.3 21.5 V Bootstrap pin voltage BSTx -0.3 115 V Bootstrap pin voltage BSTx with respect to SHx -0.3 21.5 V Logic pin voltage INHx, INLx, MODE, DT -0.3 VGVDD+0.3 V High-side gate drive pin voltage GHx -22 115 V High-side gate drive pin voltage GHx with respect to SHx -0.3 22 V Low-side gate drive pin voltage GLx -0.3 VGVDD+0.3 V High-side source pin voltage SHx -22 100 V Ambient temperature, TA –40 125 °C Junction temperature, TJ –40 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings Comm VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±250 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating temperature range (unless otherwise noted) MIN NOM MAX UNIT VGVDD Power supply voltage GVDD 5 20 V VSHx High-side source pin voltage SHx -2 85 V VSHx Transient 2µs high-side source pin voltage SHx -22 85 V VBST Bootstrap pin voltage BSTx 5 105 V VBST Bootstrap pin voltage BSTx with respect to SHx 5 20 V VIN Logic input voltage INHx, INLx, MODE, DT 0 GVDD V fPWM PWM frequency INHx, INLx 0 200 kHz VSHSL Slew rate on SHx pin (DRV8300D and DRV8300DI) 2 V/ns VSHSL Slew rate on SHx pin (DRV8300N and DRV8300NI) 50 V/ns CBOOT (1) Capacitor between BSTx and SHx (DRV8300D and DRV8300DI) 1 µF TA Operating ambient temperature –40 125 °C TJ Operating junction temperature –40 150 °C (1) Current flowing through boot diode (DBOOT) needs to be limited for CBOOT > 1µF DRV8300 SLVSFG5 – SEPTEMBER 2020 www.ti.com 6 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: DRV8300 |
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