Data Sheet

ADL5206

Rev. 0 | Page 7 of 25

ABSOLUTE MAXIMUM RATINGS

Table 3.

Rating

Differential Output Voltage Swing ×

Bandwidth Product

5 V Supply Voltage

4 V-GHz

3.3 V Supply Voltage

3 V-GHz

5.4 V

PWUP, D0 to D4, MODE0, MODE1, LATCH

−0.5 V to +3.6 V

Input Voltage (VIN+ and VIN−)

−0.5 V to +3.1 V

±1 V

500 mW

Temperature

Maximum Junction

135°C

Operating Range

−40°C to +85°C

Storage Range

−65°C to +150°C

1

When referring to a single function of a multifunction pin in the parameters,

only the portion of the pin name that is relevant to the specification is listed.

For full pin names of multifunction pins, refer to the Pin Configuration and

Function Descriptions section.

2

The differential input voltage limit is significantly lower than the maximum

input swing of 6.2 V p-p with a 5 V supply. The maximum input swing is for

the lowest gain setting of 2 dB. As the gain setting increases, the maximum

input swing must be reduced correspondingly to maintain the same maximum

output swing. The maximum output swing is based on P1dB.

Stresses at or above those listed under absolute maximum

ratings can cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

Table 4 shows the thermal resistance from the die to ambient

Table 4. Thermal Resistance

Package Type

Unit

CP-20-16

55.42 16.01

9.08

°C/W

JUNCTION TO BOARD THERMAL IMPEDANCE

thermal impedance from the die to the leads of the ADL5206.

The value given in Table 4 is based on the standard PCB described

in the JESD51-7 standard for thermal testing of surface-mount

components. PCB size and complexity (number of layers) affect

thermal impedance to calculate the die temperature (also

temperature does not exceed the specified limit of 135°C. For

example, if the PCB temperature is 85°C, the die temperature

is given by

ESD CAUTION