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OPA615ID Datasheet(PDF) 23 Page - Texas Instruments

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Part # OPA615ID
Description  Wide-Bandwidth, DC Restoration Circuit
PDF  26 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

OPA615ID Datasheet(HTML) 23 Page - Texas Instruments

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BOARD LAYOUT GUIDELINES
INPUT AND ESD PROTECTION
External
Pin
+V
CC
−V
CC
Internal
Circuitry
OPA615
SBOS299B – FEBRUARY 2004 – REVISED JULY 2005
d) Connections to other wideband devices on the
board may be made with short direct traces or
Achieving optimum performance with a high- fre-
through onboard transmission lines. For short
quency amplifier like the OPA615 requires careful
connections, consider the trace and the input to the
attention to printed circuit board (PCB) layout para-
next device as a lumped capacitive load. Relatively
sitics and external component types. Recommen-
wide traces (50mils to 100mils) should be used,
dations that will optimize performance include:
preferably with ground and power planes opened up
around them.
a) Minimize parasitic capacitance to any AC
ground for all of the signal I/O pins. Parasitic
e) Socketing a high-speed part like the OPA615 is
capacitance on the output and inverting input pins
not recommended. The additional lead length and
can cause instability; on the non-inverting input, it can
pin-to-pin capacitance introduced by the socket can
react with the source impedance to cause uninten-
create an extremely troublesome parasitic network
tional bandlimiting. To reduce unwanted capacitance,
which can make it almost impossible to achieve a
a window around the signal I/O pins should be
smooth, stable frequency response. Best results are
opened in all of the ground and power planes around
obtained by soldering the OPA615 directly onto the
those pins. Otherwise, ground and power planes
PCB.
should be unbroken elsewhere on the board.
b) Minimize the distance (< 0.25") from the power
supply pins to high frequency 0.1
µF decoupling
The OPA615 is built using a very high-speed, comp-
capacitors. At the device pins, the ground and power
lementary bipolar process. The internal junction
plane layout should not be in close proximity to the
breakdown voltages are relatively low for these very
signal I/O pins. Avoid narrow power and ground
small geometry devices. These breakdowns are re-
traces to minimize inductance between the pins and
flected in the Absolute Maximum Ratings table where
the decoupling capacitors. The power-supply connec-
an absolute maximum
±6.5V supply is reported. All
tions should always be decoupled with these capaci-
device pins have limited ESD protection using internal
tors. An optional supply-decoupling capacitor across
diodes to the power supplies, as shown in Figure 53.
the two power supplies (for bipolar operation) will
improve 2nd-harmonic distortion performance. Larger
(2.2
µF to 6.8µF) decoupling capacitors, effective at a
lower frequency, should also be used on the main
supply pins. These may be placed somewhat farther
from the device and may be shared among several
devices in the same area of the PCB.
c) Careful selection and placement of external
components will preserve the high frequency
performance of the OPA615. Resistors should be a
very low reactance type. Surface-mount resistors
Figure 53. Internal ESD Protection
work best and allow a tighter overall layout. Metal-film
and carbon composition, axially-leaded resistors can
also provide good high frequency performance.
These diodes also provide moderate protection to
Again, keep these leads and PCB trace length as
input overdrive voltages above the supplies. The
short as possible. Never use wirewound-type re-
protection diodes can typically support 30mA continu-
sistors in a high frequency application. Other network
ous current. Where higher currents are possible (for
components, such as noninverting input termination
example, in systems with
±15V supply parts driving
resistors, should also be placed close to the package.
into the OPA615), current-limiting series resistors
should be added into the two inputs. Keep these
resistor values as low as possible since high values
degrade both noise performance and frequency re-
sponse.
23



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