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ABSOLUTE MAXIMUM RATINGS

(1)

DISSIPATION RATING TABLE

THS4513-SP

SLOS539A – SEPTEMBER 2007 – REVISED OCTOBER 2007

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGED DEVICES

TEMPERATURE

CERAMIC FLATPACK

SYMBOL

–55

°C to 125°C

5962-0722301VFA

5962-0722301VFA

(1)

For the most current package and ordering information, see the Package Option Addendum at the end

of this document, or see the TI website at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

over operating free-air temperature range (unless otherwise noted)

UNIT

Supply voltage

6 V

Input voltage

Differential input voltage

4 V

Output current

200 mA

Continuous power dissipation

See Dissipation Rating Table

Maximum junction temperature

150

°C

Operating free-air temperature range

–55

°C to 125°C

Storage temperature range

–65

°C to 150°C

HBM

2000

ESD ratings

CDM

1500

MM

100

(1)

The absolute maximum ratings under any condition are limited by the constraints of the silicon process. Stresses above these ratings

may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These

are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.

POWER RATING

PACKAGE

W (16)

14.7

°C/W

189

°C/W

661 mW

132 mW

2

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