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AT45DB161E Datasheet(PDF) 41 Page - Dialog Semiconductor

Part # AT45DB161E
Description  16-Mbit DataFlash (with Extra 512-kbits) 2.3 V or 2.5 V Minimum SPI Serial Flash Memory
PDF  80 Pages
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Manufacturer  DIALOG [Dialog Semiconductor]
Direct Link  http://www.dialog-semiconductor.com/
Logo DIALOG - Dialog Semiconductor

AT45DB161E Datasheet(HTML) 41 Page - Dialog Semiconductor

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AT45DB161E
DS-AT45DB161E–8782N–03-2021
12
Buffer and Page Size Configuration
The memory array of DataFlash devices is actually larger than other Serial Flash devices in that extra user-
accessible bytes are provided in each page of the memory array. For the AT45DB161E, there are an extra 16
bytes of memory in each page for a total of an extra 64 kB (512 kbits) of user-accessible memory. Therefore, the
device density is actually 16.5 Mbits instead of 16 Mbits.
Some designers, however, might not want to take advantage of this extra memory and instead architect their
software to operate on a “power of 2” binary, logical addressing scheme. To allow this, the DataFlash can be
configured so that the buffer and page sizes are 512 bytes instead of the standard 528 bytes. Also, the
configuration of the buffer and page sizes is reversible and can be changed from 528 bytes to 512 bytes or from
512 bytes to 528 bytes. The configured setting is stored in an internal nonvolatile register so that the buffer and
page size configuration is not affected by power cycles. The nonvolatile register has a limit of 10,000
erase/program cycles; therefore, be careful not to switch between the size options more than 10,000 times.
Devices are initially shipped from Adesto with the buffer and page sizes set to 528 bytes. Devices can be ordered
from Adesto pre-configured for the “power of 2” binary size of 512 bytes. For details, see Section 28, Ordering
Information, on page 70.
To configure the device for “power of 2” binary page size (512 bytes), a four-byte opcode sequence of 3Dh, 2Ah,
80h, and A6h must be clocked into the device. After the last bit of the opcode sequence has been clocked in, the
CS pin must be deasserted to initiate the internally self-timed configuration process and nonvolatile register
program cycle. Programming of the nonvolatile register takes a time of tEP, during which time the RDY/BUSY bit in
the Status Register indicates that the device is busy. The device does not need to be power cycled after the
configuration process and register program cycle in order for the buffer and page size to be configured to 512
bytes.
To configure the device for standard DataFlash page size (528 bytes), a four-byte opcode sequence of 3Dh, 2Ah,
80h, and A7h must be clocked into the device. After the last bit of the opcode sequence has been clocked in, the
CS pin must be deasserted to initial the internally self-timed configuration process and nonvolatile register program
cycle. Programming of the nonvolatile register takes a time of tEP, during which time the RDY/BUSY bit in the
Status Register indicates that the device is busy. The device does not need to be power cycled after the
configuration process and register program cycle in order for the buffer and page size to be configured to 528
bytes.
Table 12-1. Buffer and Page Size Configuration Commands
Figure 12-1. Buffer and Page Size Configuration
Command
Byte 1
Byte 2
Byte 3
Byte 4
“Power of 2” binary page size (512 bytes)
3Dh
2Ah
80h
A6h
DataFlash page size (528 bytes)
3Dh
2Ah
80h
A7h
CS
SI
3Dh
2Ah
80h
Opcode
Byte 4
Each transition represents eight bits



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