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LT3757 Datasheet(PDF) 19 Page - Analog Devices |
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LT3757 Datasheet(HTML) 19 Page - Analog Devices |
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19 / 22 page ![]() LT3935 19 Rev. 0 For more information www.analog.com APPLICATIONS INFORMATION Planning for Thermal Shutdown TheLT3935automaticallystopsswitchingwhentheinternal temperatureistoohigh.Thetemperaturelimitisguaranteed to be higher than the operational temperature of the part. During thermal shutdown, all switching is terminated, SS is forced low, and the LEDs are off. The exposed pad on the bottom of the package must be soldered to a ground plane. Vias placed directly under the package are necessary to dissipate heat. Following these guidelines, the official four-layer demo board DC2987A reduces the thermal resistance, θJA to 27°C/W. With a compromised board design, θJA could be 40°C/W or higher. Designing the Printed Circuit Board Note that large switched currents flow through the local input capacitors and the VIN and GND pins. The loops traveled by these currents should be made as small as possible by keeping the capacitors as close as possible to these pins. These capacitors, as well as the inductor, should be placed on the same side of the board as the LT3935 and connected on the same layer. Other large, bulk input capacitors can be safely placed farther from the chip and on the other side of the board. Create a Kelvin ground network by keeping the ground connection for all of the other components separate. It should only join the ground for the input and output capacitors and the return path for the LED current at the exposed pad. There are a few other aspects of the board design that improve performance. An unbroken ground plane on the second layer dissipates heat, but also reduces noise. Likewise minimizing the area of the SW and BST nodes reduces noise. The traces for FB and VC should be kept short to lessen the susceptibility to noise of these high impedance nodes. Matched kelvin connections from the external current sense resistor RS to the ISP and ISN pins are essential for current regulation accuracy. The 2.2μF INTVCC and VREF capacitors as well as the 100nF BST capacitor should be placed as closely as possible to their respective pins. A capacitor for the CTRL pin should be placed near the pin for analog dimming. The PWM pin can be tied to VREF or INTVCC. Please refer to the demo board layout of the LT3935 for an example of how to implement these recommendations. |
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