ADN4621 datasheet(9/24 Pages) AD

9 / 24 page

Data Sheet

ADN4620/ADN4621

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 9 of 24

Table 9.

Parameter

Rating

VDD1 to GND1, VDD2 to GND2

−0.3 V to +2 V

VIO1 to GND1, VIO2 to GND2

−0.3 V to +4 V

Input Voltage REFRESH1 to GND1, REFRESH2

to GND2

−0.3 V to +2 V

Input Voltage (DINx+ pin, DINx− pin) to GNDx on

the Same Side

−0.3 V to +4 V

Output Voltage (DOUTx+ pin, DOUTx− pin) to

GNDx on the Same Side

−0.3 V to +2 V

Short-Circuit Duration (DOUTx+ pin, DOUTx− pin)

to GNDx on the Same Side

Continuous

Operating Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature (TJ Maximum)

150°C

Power Dissipation

(TJ maximum − TA)/θJA

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operation environment. Close attention to PCB

thermal design is required.

θJA is the natural convection, junction to ambient thermal resistance

measured in a one cubic foot sealed enclosure. ΨJT is the junction

to top thermal characterization parameter.

Table 10. Thermal Resistance

Package Type1

θJA

ΨJT

Unit

RS-20 (ADN4620)

66.1

5.2

°C/W

RS-20 (ADN4621)

63.8

°C/W

1 Test Condition 1: thermal impedance simulated with 4-layer standard JEDEC

PCB.

Table 11. Maximum Continuous Working Voltage1, RS-20 Shrink Small Outline Package [SSOP]

Parameter

Rating

Constraint

AC Voltage

Bipolar Waveform

Basic Insulation

1182 V rms

Basic insulation rating per IEC60747-17. Accumulative failure rate over lifetime (FROL) ≤

1000 ppm at 20 years.

1057 V rms