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STA1295 Datasheet(PDF) 76 Page - STMicroelectronics

Part # STA1295
Description  Accordo5 - Automotive infotainment processors for display audio and cluster applications
PDF  109 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STA1295 Datasheet(HTML) 76 Page - STMicroelectronics

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Electrical characteristics
STA1295, STA1275
76/109
DS12586 Rev 5
4.4
Electrical sensitivity
Based on two different tests (ESD and LU) using specific measurement methods, the
product is stressed in order to determine its performance in terms of electrical sensitivity.
4.4.1
Electrostatic discharge (ESD)
Note:
All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for
Automotive Grade Integrated Circuits.
A device will be defined as a failure if after exposure to ESD pulses the device no longer
meets the device specification requirements. Complete DC parametric and functional
testing shall be performed per applicable device specification at room temperature followed
by hot temperature, unless specified otherwise in the device specification.
4.4.2
Static latch-up (LU)
4.5
Thermal characteristics
Devices are available in both Consumer Grade and Automotive Grade Qualification (AEC-
Q100 Grade 3).
Table 31. ESD absolute maximum ratings
Symbol
Ratings
Conditions
Class
Max value(1)
1. Data is based on qualification results, not tested in production.
Unit
VESD0 (HBM)
Electrostatic
discharge voltage
(Human body model)
Conforming to
AEC-Q100-002
H2
2000
V
VESD (CDM)
Electrostatic
discharge voltage
(Charged device
model)
Conforming to
AEC-Q100-011
C4
500
750 (for corners)
Table 32. Latch-up results
Symbol
Ratings
Conditions
Class
LU
Static latch-up class
Conforming to JESD 78
II level A
Table 33. Thermal characteristics
Symbol
Parameter
Limit values
Unit
Min
Max
Toper
SR
Operative ambient temperature
-40
+85
°C
Tj
SR
Operative junction temperature
-40
+125
°C
Tst
SR
Storage temperature
-55
+125
°C
Θj-a
S
Thermal resistance junction to ambient(1)
—
19.6
°C/W
Ψj-b
S
Thermal resistance junction to board(1)
—11.8
°C/W



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