L99DZ100GP datasheet(27/197 Pages) STMICROELECTRONICS

Part #	L99DZ100GP

Description	Automotive door module with LIN and HS-CAN (L99DZ100G) or HS-CAN supporting selective wake up (L99DZ100GP)

PDF	197 Pages

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Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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27 / 197 page

DS11546 Rev 5

27/197

L99DZ100G, L99DZ100GP

Electrical specifications

196

Figure 7. LQFP64 package and PCB thermal configuration

Note:

Layout condition for Thermal Characterization (board finishing thickness 1.5 mm +/- 10%,

board four layers, board dimension 77 mm x 114 mm, board material FR4, Cu thickness

0,070 mm for outer layers, 0.0035 mm for inner layers, thermal vias separation 1.2 mm.

3.4

Electrical characteristics

3.4.1

Supply and supply monitoring

All SPI communication, logic and oscillator parameter are working down to VSREG = 3.5 V

and parameter are as specified in the according chapters (guaranteed by design).



SPI thresholds



Oscillator frequency (delay times correctly elapsed)



Internal register status correctly kept (reset at default values for VSREG< VPOR)



Reset threshold correctly detected

The voltages are referred to ground and currents are assumed positive, when the current

flows into the pin. 6 V ≤ VS ≤ 28 V; 6 V ≤ VSREG ≤ 28 V; Tj = -40 °C to 150 °C, unless

otherwise specified.

L99DZ100GP Datasheet(PDF) 27 Page - STMicroelectronics